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Journal articles on the topic 'Microelectronic technology'

Author: Grafiati

Published: 28 May 2022

Last updated: 30 July 2025

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1

Liu, Pu. "Current development status and application analysis of microelectronics technology." Applied and Computational Engineering 11, no. 1 (2023): 210–15. http://dx.doi.org/10.54254/2755-2721/11/20230235.

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With the rapid development of microelectronic technology in the 21st century, microelectronic technology has been widely used in various fields, which has promoted various fields and improved the level of industrialization in the world. But there are still many problems, so this paper will introduce the application of microelectronics technology, let readers understand that microelectronics technology has a strong research prospect. The research methods of this paper are as follows. Firstly, the importance and significance of microelectronic technology are described, and the development proces

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2

Haskard, M. R. "Microelectronic sensor technology." Journal of Physics E: Scientific Instruments 19, no. 11 (1986): 891–96. http://dx.doi.org/10.1088/0022-3735/19/11/001.

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Fu, Boyuan. "Research on the application status of microelectronics technology in different fields." Applied and Computational Engineering 11, no. 1 (2023): 216–23. http://dx.doi.org/10.54254/2755-2721/11/20230239.

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The main focus is on the current status of the application of microelectronics in different fields. The current state of research in microelectronics is shown more visually through two experiments with diodes and MOS transistors. Then through its application in integrated circuits and automatic control shows the importance of microelectronics in today's information age, and finally through the prospect of future prospects, rational analysis of the development trend in the field of artificial intelligence, and put forward certain ideas, microelectronics can make artificial intelligence more acc

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Zhang, Ruolei. "Application and Development Trend of 5G Communication Technology in Microelectronics." International Journal of Computer Science and Information Technology 2, no. 1 (2024): 397–402. http://dx.doi.org/10.62051/ijcsit.v2n1.42.

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This study delves into the synergistic relationship between 5G communication technology and microelectronics, and how it shapes the future of the scientific and technological landscape. Through a comprehensive blend of theoretical analysis and empirical research, we examine how 5G technology propels the advancement of microelectronics, and vice versa. Our findings reveal a symbiotic relationship between the two, driving the overall progress of the electronic information industry. The distinctive features of 5G technology—high speed, minimal delay, and extensive connectivity—demand that microel

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Wang, Yinghao. "Research Progress on Key Technologies of Microelectronics for Industry 4.0." Academic Journal of Science and Technology 2, no. 3 (2022): 4–6. http://dx.doi.org/10.54097/ajst.v2i3.1434.

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With the continuous improvement of China's science and technology and economic development level, automatic control runs through all walks of life in China, and the Industry 4.0 era dominated by Internet of Things and intelligent manufacturing has gradually matured. Therefore, according to the changing market requirements, automatic control requirements have become higher and higher, and it is more and more common to integrate automatic control technology in the field of microelectronics. With the use of microelectronic technology, electrical control can be carried out more accurately, and the

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Nikitin, A. V. "Size measurements in microelectronic technology." Measurement Techniques 55, no. 8 (2012): 867–75. http://dx.doi.org/10.1007/s11018-012-0052-6.

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7

Slutzker, Patricia C. "Ergonomics in Microelectronic Office Technology." Occupational Health Nursing 33, no. 12 (1985): 610–14. http://dx.doi.org/10.1177/216507998503301206.

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Криштоп, В. Г., Д. А. Жевненко, П. В. Дудкин та ін. "ТЕХНОЛОГИЯ И ПРИМЕНЕНИЕ ЭЛЕКТРОХИМИЧЕСКИХ ПРЕОБРАЗОВАТЕЛЕЙ". NANOINDUSTRY Russia 96, № 3s (2020): 450–55. http://dx.doi.org/10.22184/1993-8578.2020.13.3s.450.455.

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Электрохимические системы очень перспективны для разработки новой элементной базы для микроэлектроники и для использования в широком спектре инженерных задач. Мы разработали новую микроэлектронную технологию для изготовления электрохимических преобразователей (ЭХП) и новые приборы на основе новых электрохимических микроэлектронных чипов. Планарные электрохимические преобразователи могут использоваться в акселерометрах, сейсмических датчиках, датчиках вращения, гидрофонах и датчиках давления. Electrochemical systems are very promising for the development of a new element base for microelectroni

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9

De Ying Chen and Guo Hang Tang. "Vacuum microelectronic diode using bonding technology." Sensors and Actuators A: Physical 55, no. 2-3 (1996): 149–52. http://dx.doi.org/10.1016/s0924-4247(97)80070-2.

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10

Zhu, Bo. "Microelectronics innovation and implementation in intelligent transportation systems." Theoretical and Natural Science 9, no. 1 (2023): 208–13. http://dx.doi.org/10.54254/2753-8818/9/20240751.

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Under the background of urbanization and rapid development of transportation, the innovation of intelligent transportation system has become the key to improving traffic efficiency, relieving traffic pressure, and solving traffic problems. With the continuous progress of microelectronics technology, its application in the field of intelligent transportation is becoming more and more eye-catching. This paper focuses on the innovation and realization of micro-electronic technology in intelligent transportation system, and discusses the application of micro-electronic technology in intelligent na

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Angermann, Heike, Abdelazize Laades, U. Stürzebecher, et al. "Wet-Chemical Preparation of Textured Silicon Solar Cell Substrates: Surface Conditioning and Electronic Interface Properties." Solid State Phenomena 187 (April 2012): 349–52. http://dx.doi.org/10.4028/www.scientific.net/ssp.187.349.

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The dominance of crystalline silicon (Si) in photovoltaics can be ascribed partly to the extensive knowledge about this material, which has been accumulated in microelectronics technology. Methods to passivate Si interfaces, which were developed for microelectronic device technologies, have been extended to solar cell manufacturing in the past. These methods, however, have been optimised for polished substrates, and do not work so effective with textured surfaces, which commonly used in the fabrication of high efficiency Si solar cells to enhance anti-reflection properties.

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12

Chen, Yuan, and Xiao Wen Zhang. "Applications of Focused Ion Beam Technology in Bonding Failure Analysis for Microelectronic Devices." Applied Mechanics and Materials 58-60 (June 2011): 2171–76. http://dx.doi.org/10.4028/www.scientific.net/amm.58-60.2171.

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Focused ion beam (FIB) system is a powerful microfabrication tool which uses electronic lenses to focus the ion beam even up to nanometer level. The FIB technology has become one of the most necessary failure analysis and failure mechanism study tools for microelectronic device in the past several years. Bonding failure is one of the most common failure mechanisms for microelectronic devices. But because of the invisibility of the bonding interface, it is difficult to analyze this kind of failure. The paper introduced the basic principles of FIB technology. And two cases for microelectronic de

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13

GOGÉ, M., D. BAUZA, and G. VELASCO. "LARGE DIFFUSION OXYGEN SENSOR IN MICROELECTRONIC TECHNOLOGY." Le Journal de Physique Colloques 47, no. C1 (1986): C1–795—C1–799. http://dx.doi.org/10.1051/jphyscol:19861121.

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Fan, Wenbo. "Analysis on the application and development of microelectronic technology." Applied and Computational Engineering 6, no. 1 (2023): 209–13. http://dx.doi.org/10.54254/2755-2721/6/20230768.

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The advancement of science and technology, as well as the passage of time, have resulted in an increase in the use of high-tech products in our daily lives, with microelectronics playing an important role as a fundamental technology. Today, the microelectronics industry is the world's sunrise industry. China is rapidly expanding its microelectronics industry. Microelectronics technology is one of the world's fastest growing technologies, and it is the foundation of the information industry in the information age. Now, microelectronics technology has become a standard for measuring a country's

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15

te Velde, Dirk Willem. "Foreign Ownership, Microelectronic Technology and Skills: Evidence for British Establishments." National Institute Economic Review 185 (July 2003): 93–106. http://dx.doi.org/10.1177/00279501031851010.

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This paper uses the Workplace Employee Relations Survey panel for 1990–1998 to investigate the relationship between foreign ownership, skill-structure and use of microelectronic technologies in British establishments. We find that foreign-owned establishments are early adopters of new microelectronic technologies and employ more non-manual workers (more senior technical professional workers, less skilled manual workers). Because foreign-owned establishments are early adopters of new technology, an increase in foreign ownership can partly explain a recent improvement in the relative position of

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16

Yan, Chenqi, and Mengchao Tan. "The Use of Artificial Intelligence-Based Optical Remote Sensing and Positioning Technology in Microelectronic Processing Technology." Wireless Communications and Mobile Computing 2021 (December 21, 2021): 1–10. http://dx.doi.org/10.1155/2021/8464612.

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The purpose is to make defect detection in microelectronic processing technology fast, accurate, reliable, and efficient. A new optical remote sensing-optical beam induced resistance change (ORS-OBIRCH) target recognition and location defect detection method is proposed based on an artificial intelligence algorithm, optical remote sensing (ORS), and optical beam induced resistance change (OBIRCH) location technology using deep convolutional neural network. This method integrates the characteristics of high resolution and rich details of the image obtained by ORS technology and combines the adv

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17

Nam, Irina, Dong Seon Uh, Chang Il Oh, Jin Kuk Lee, Jae Min Oh, and Jong Seob Kim. "Synthesis and Solubility Study of the Polyamides Containing 4,4'-(9- fluorenylidene)dianiline in the Backbone as an Antireflecting Spin-on Hardmask Materials." Eurasian Chemico-Technological Journal 9, no. 1 (2007): 39–46. https://doi.org/10.18321/ectj253.

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Due to the continuous demand for smaller microelectronic devices, there exists a need to reduce the size of structural shapes in microelectronics and other related industries. Toward this end, effective lithographic techniques are essential to achieve a reduction in the size of microelectronic structures. Typical lithographic processes involve etch resistant photoresist underlying materials having antireflecting properties at a certain wavelength exposure. In this work, such materials were synthesized by the step-polymerization of diamines 2,2'-bis(3-amino- 4-hydroxyphenyl)hexafluoropropane (6

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18

Ren, Yanru, Min Zhu, Dongyu Xu, et al. "Overview on Radiation Damage Effects and Protection Techniques in Microelectronic Devices." Science and Technology of Nuclear Installations 2024 (March 30, 2024): 1–17. http://dx.doi.org/10.1155/2024/3616902.

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With the rapid advancement of information technology, microelectronic devices have found widespread applications in critical sectors such as nuclear power plants, aerospace equipment, and satellites. However, these devices are frequently exposed to diverse radiation environments, presenting significant challenges in mitigating radiation-induced damage. Hence, this review aims to delve into the intricate damage mechanisms of microelectronic devices within various radiation environments and highlight the latest advancements in radiation-hardening techniques. The ultimate goal is to bolster the r

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19

Miyazaki, Toshiyuki. "Microelectronic technology and aging of the labour force." Advanced Robotics 2, no. 3 (1987): 299–310. http://dx.doi.org/10.1163/156855387x00246.

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20

Declerck, G. "Book review: Methods and Materials in Microelectronic Technology." IEE Proceedings I Solid State and Electron Devices 133, no. 2 (1986): 63. http://dx.doi.org/10.1049/ip-i-1.1986.0015.

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21

Wang, Weidong, Yong Ruan, Zaifa Zhou, and Min Liu. "Design and Fabrication of Micro/Nano Sensors and Actuators, Volume II." Micromachines 15, no. 6 (2024): 667. http://dx.doi.org/10.3390/mi15060667.

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Microelectromechanical system (MEMS) sensors are a miniaturized sensor technology that integrates sensors with microelectronic components using microelectromechanical system manufacturing technology [...]

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22

Grattan, K. T. V., and A. W. Palmer. "Optical-fibre sensor technology: a challenge to microelectronic sensors?" Sensors and Actuators A: Physical 30, no. 1-2 (1992): 129–37. http://dx.doi.org/10.1016/0924-4247(92)80207-j.

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23

Varlan, A. R., and W. Sansen. "Characterisation of planar electrodes realised in planar microelectronic technology." Medical & Biological Engineering & Computing 34, no. 4 (1996): 308–12. http://dx.doi.org/10.1007/bf02511244.

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24

Bobrinetskii, I. I., I. A. Komarov, K. K. Lavrent’ev, et al. "Features of the integration of graphenes in microelectronic technology." Russian Microelectronics 43, no. 7 (2014): 477–82. http://dx.doi.org/10.1134/s1063739714070038.

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25

Li, Chang You, Wen Hua Wang, He Ping Wang, Ming Ming Jia, and Jing Yu Shang. "Research on Microelectronic Packaging Position Detection Based on Machine Vision." Applied Mechanics and Materials 389 (August 2013): 477–82. http://dx.doi.org/10.4028/www.scientific.net/amm.389.477.

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A microelectronic packaging position detection method based on machine vision is proposed. Analyze the color and shape characteristics of the FC-D30 handle circuit boards, extract the R component. Complex background is removed through using image segmentation technology, this research utilizes image smoothing technology to eliminate the noise after segmentation. And use Sobel operator to do edge detection. The package position is detected by using image feature extraction techniques, and finally the position is located accurately. The experimental results show that, the average detection time

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26

Lee, Jong Jo, Jong Woo Kim, and Jae Kyoo Lim. "Study on Flywheel Rotating System Using Aerodynamic Energy of Running Vehicle." Advanced Materials Research 717 (July 2013): 350–53. http://dx.doi.org/10.4028/www.scientific.net/amr.717.350.

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Mechatronics is an integration technology which is the mutual penetration of mechanical technology, microelectronic technology and information technology and the inevitable development trend of electromechanical industry. This paper describes the overview, core technology and main application fields of mechatronics technology and points out its development trend.

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Wang, Huan Yun, and Chun Hui Pan. "On the Application and the Development Trend of Mechatronics Technology." Advanced Materials Research 717 (July 2013): 895–98. http://dx.doi.org/10.4028/www.scientific.net/amr.717.895.

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Mechatronics is an integration technology which is the mutual penetration of mechanical technology, microelectronic technology and information technology and the inevitable development trend of electromechanical industry. This paper describes the overview, core technology and main application fields of mechatronics technology and points out its development trend.

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28

Zhu, Zhiyuan, Sixiang Zhang, Shenglin Ma, and Ziyu Liu. "Special Issue “Building Three-Dimensional Integrated Circuits and Microsystems”." Processes 11, no. 3 (2023): 816. http://dx.doi.org/10.3390/pr11030816.

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29

Dormidoshina, D. A., Yu V. Rubtsov, and M. L. Savin. "The Application of ICMH in the Collection, Processing and Analysis of Information on the Reliability of Microelectronic Products." Nano- i Mikrosistemnaya Tehnika 22, no. 9 (2020): 485–88. http://dx.doi.org/10.17587/nmst.22.485-488.

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he most objective and reliable information for assessing the possibility of using microelectronic products in electronic equipment is provided by the data obtained as a result of their collection, processing and analysis from organizations ordering, designing, developing, manufacturing, testing, supplying, using and operating products. The analysis of such data makes it possible to assess the level of the actual reliability of the product, to identify weak points in design technology, manufacturing, application and operation standards, and to develop specific measures to ensure reliability. Cu

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Dessy, RaymondE. "The microelectronic chemical toolbox." Chemometrics and Intelligent Laboratory Systems 8, no. 3 (1990): 311. http://dx.doi.org/10.1016/0169-7439(90)80021-w.

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31

Agranat, A., and A. Yariv. "Semiparallel microelectronic implementation of neural network models using CCD technology." Electronics Letters 23, no. 11 (1987): 580–81. http://dx.doi.org/10.1049/el:19870416.

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Dibbern, U. "A substrate for thin-film gas sensors in microelectronic technology." Sensors and Actuators B: Chemical 2, no. 1 (1990): 63–70. http://dx.doi.org/10.1016/0925-4005(90)80010-w.

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Sidorenko, V. P., V. D. Zhora, O. I. Radkevich, et al. "Assembly technology and design features of microelectronic coordinate-sensitive detectors." Технология и конструирование в электронной аппаратуре, no. 1 (2018): 21–27. http://dx.doi.org/10.15222/tkea2018.1.21.

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The design features and assembly technology of microelectronic coordinate-sensitive detectors of charged particles for spectroscopy are considered. The device is based on the specialized very-large-scale integration (VLSI) crystal manufactured using CMOS technology and containing a charge-sensitive matrix designed to detect isotope ions in a wide mass spectrum of the test substance. The range of concentrations measured by devices is also wide and ranges from 10–7 to 100%. The VLSI crystal is placed on a multilayer ceramic basis. The devices also contain a Hamamatsu micro-channel plate (MCP), e

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34

Thorkildsen, Ron. "Keynote Address: Microelectronic Technology and the Hearing Impaired: The Future." American Annals of the Deaf 130, no. 5 (1985): 324–31. http://dx.doi.org/10.1353/aad.2012.0894.

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35

Bergles, A. E. "Evolution of cooling technology for electrical, electronic, and microelectronic equipment." IEEE Transactions on Components and Packaging Technologies 26, no. 1 (2003): 6–15. http://dx.doi.org/10.1109/tcapt.2003.809664.

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36

Харламов, Н. Р., А. С. Рябышенков та В. И. Каракеян. "МЕТОДИКА ОЦЕНКИ ВЛИЯНИЯ МИКРОЭЛЕКТРОННОГО ПРОИЗВОДСТВА НА ЭКОЛОГИЧЕСКУЮ БЕЗОПАСНОСТЬ НАУКОЕМКОЙ ПРИРОДНО-ТЕХНИЧЕСКОЙ СИСТЕМЫ". Южно-Сибирский научный вестник, № 2(60) (30 квітня 2025): 25–31. https://doi.org/10.25699/sssb.2025.60.2.009.

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Рассматриваются результаты апробации методики оценки влияния микроэлектронного производства на экологическую безопасность наукоемкой природно-технической системы (НПТС) г. Зеленограда. Оценочным показателем служит кратность превышения техногенной нагрузки над экологической техноемкостью территории. Влияние предприятий микроэлектроники учитывается коэффициентом относительной опасности примеси, характерных для применяемых технологий. Экспериментально-расчетным путем установлено, что основным реципиентом загрязнений от городского производственно-хозяйственного комплекса является атмосферный возду

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Chugunov, E. Y., A. I. Pogalov, and S. P. Timoshenkov. "Engineering Calculations of Microelectronic Products Parts and Assemblies Using Finite-Element Modeling." Proceedings of Universities. Electronics 26, no. 3-4 (2021): 255–64. http://dx.doi.org/10.24151/1561-5405-2021-26-3-4-255-264.

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In the context of increasing the electronic components integration level, growing functionality and packaging density, as well as reducing the electronics weight and size, an integrated approach to engineering calculations of parts and assemblies of modern functionally and technically complex microelectronic products is required. Of particular importance are engineering calculations and structural modeling using computer-aided engineering systems, and also assessment of structural, technological and operational factors’ impact on the products reliability and performance. This work presents an

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Mathias, Jean-Denis, Pierre-Marie Geffroy, and Jean-François Silvain. "Architectural optimization for microelectronic packaging." Applied Thermal Engineering 29, no. 11-12 (2009): 2391–95. http://dx.doi.org/10.1016/j.applthermaleng.2008.12.037.

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Buriak, Jillian M. "High surface area silicon materials: fundamentals and new technology." Philosophical Transactions of the Royal Society A: Mathematical, Physical and Engineering Sciences 364, no. 1838 (2005): 217–25. http://dx.doi.org/10.1098/rsta.2005.1681.

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Crystalline silicon forms the basis of just about all computing technologies on the planet, in the form of microelectronics. An enormous amount of research infrastructure and knowledge has been developed over the past half-century to construct complex functional microelectronic structures in silicon. As a result, it is highly probable that silicon will remain central to computing and related technologies as a platform for integration of, for instance, molecular electronics, sensing elements and micro- and nanoelectromechanical systems. Porous nanocrystalline silicon is a fascinating variant of

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Arduino, Daniele, Stefano Stassi, Chiara Spano, Luciano Scaltrito, Sergio Ferrero, and Valentina Bertana. "Silicon and Silicon Carbide Recrystallization by Laser Annealing: A Review." Materials 16, no. 24 (2023): 7674. http://dx.doi.org/10.3390/ma16247674.

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Modifying material properties within a specific spatial region is a pivotal stage in the fabrication of microelectronic devices. Laser annealing emerges as a compelling technology, offering precise control over the crystalline structure of semiconductor materials and facilitating the activation of doping ions in localized regions. This obviates the necessity for annealing the entire wafer or device. The objective of this review is to comprehensively investigate laser annealing processes specifically targeting the crystallization of amorphous silicon (Si) and silicon carbide (SiC) samples. Sili

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Walton, Anthony J., and Stewart Smith. "A Review of Test Structures for Characterising Microelectronic and MEMS Technology." Advances in Science and Technology 54 (September 2008): 356–65. http://dx.doi.org/10.4028/www.scientific.net/ast.54.356.

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This paper reviews present day test structures and illustrates how they have evolved to a continuously changing technology. Structures for measuring resistivity, contact resistance, feature dimensions and overlay errors are presented as are MEMS (Micro-Electro-Mechanical Systems)/microsystems specific devices.

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Murray, Conal E., E. Todd Ryan, Paul R. Besser, Christian Witt, Jean L. Jordan-Sweet, and Michael F. Toney. "Understanding stress gradients in microelectronic metallization." Powder Diffraction 27, no. 2 (2012): 92–98. http://dx.doi.org/10.1017/s0885715612000231.

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The manufacture of ultra-large scale integration technology can impose significant strain within the constituent metallization because of the mismatch in coefficients of thermal expansion between metallization and its surrounding environment. The resulting stress distributions can be large enough to induce voiding within Cu-based metallization, a key reliability issue that must be addressed. The interface between the Cu and overlying capping layers is a critical location associated with void formation. By combining conventional and glancing-incidence X-ray diffraction, depth-dependent stress d

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Keatch, Robert P., and Brian Lawrenson. "Practical Microelectronics for Electronic Engineering Students." International Journal of Electrical Engineering & Education 35, no. 2 (1998): 117–38. http://dx.doi.org/10.1177/002072099803500203.

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This article describes practical microelectronic projects and the facilities at the University of Dundee, where students learn to optimise the various fabrication processes and manufacture custom silicon chips and discrete devices. This subject is potentially very wide, including theory of devices and manufacturing technology, and some fundamental aspects of circuit design.

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Kranz, Michael, Michael Whitley, Carl Rudd, et al. "Environmentally Isolating Packaging for MEMS Sensors." International Symposium on Microelectronics 2017, no. 1 (2017): 000286–91. http://dx.doi.org/10.4071/isom-2017-wa46_150.

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Abstract Microelectronic systems employing MEMS devices are often constrained by limits on size, weight, power, and cost (SWaP-C), while also being exposed to severe shock and vibration during storage, transport, and operation. This combination of requirements has proven difficult to meet using current technology. Incorporating isolators into microelectronic systems improves performance through shock and vibration, but at the expense of cost and size metrics. Systems based on MEMS technologies have the potential to improve upon size and cost metrics for many applications. MEMS technology has m

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Mustafaeva, D. G. "Formation of Efficient Microfilm Converters with Reproducible Parameters." Nano- i Mikrosistemnaya Tehnika 23, no. 3 (2021): 157–61. http://dx.doi.org/10.17587/nmst.23.157-161.

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The use of microfilm converters provides information in the field of processing, storage, transmission and presentation of information, especially in the process of control and measurement of physical quantities, as well as in the technology of manufacturing high technology products. Microfilm transducers form an equivalent output signal, which is a function of the measured quantity; their design and manufacturing technology are interrelated and highly correlated. Microfilm transducers are manufactured using microelectronic technology, in which group methods are used in the formation of a stru

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Pernel, Carole, Ilyes Medjahed, Margaux Audibert, et al. "Electrochemistry in Photonic Devices Processing: a Disruptive Approach in GaN Technology." ECS Meeting Abstracts MA2023-02, no. 32 (2023): 1573. http://dx.doi.org/10.1149/ma2023-02321573mtgabs.

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Electrochemistry, except the electrodeposition of metal for making contacts, is rarely represented in microelectronics, despite the many possibilities it may offer like “soft” surface treatments (no surface bombardment, low damage), very sensitive methods (femtoampers sensitivity) and its large compatibility with high aspect ratio structures (TSV Cu filling). Nowadays, the More than Moore law compels researchers to look for other solutions than standard microelectronic processes to reach disruptive solutions: electrochemical processes may provide this new pathway. In that context, our study fo

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Zhou, Hongliang, Yingchong Zhang, Jun Cao, et al. "Research Progress on Bonding Wire for Microelectronic Packaging." Micromachines 14, no. 2 (2023): 432. http://dx.doi.org/10.3390/mi14020432.

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Wire bonding is still the most popular chip interconnect technology in microelectronic packaging and will not be replaced by other interconnect methods for a long time in the future. Au bonding wire has been a mainstream semiconductor packaging material for many decades due to its unique chemical stability, reliable manufacturing, and operation properties. However, the drastic increasing price of Au bonding wire has motivated the industry to search for alternate bonding materials for use in microelectronic packaging such as Cu and Ag bonding wires. The main benefits of using Cu bonding wire ov

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Hinojosa, Juan, Félix Lorenzo Martínez Viviente, Vicente Garcerán Hernández, and Ramón Ruiz Merino. "Teaching-learning model for the science of electronics." Journal of Technology and Science Education 10, no. 1 (2020): 87. http://dx.doi.org/10.3926/jotse.604.

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We present a method for the teaching of Electronics, defined as the scientific discipline that studies the movement and behavior of electrons in semiconductor materials and in vacuum. Electronics can be considered as a science with a solid physical foundation. Within the field of Electronics there are different disciplines, some of them can be considered as pure science, and some others are more oriented to applications. Our methodology has been applied to the wide range of courses that develop the different approaches to Electronics, from the physics of semiconductors or the physics of microe

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Теремов, И. А., and М. Р. Проказин. "Method of organizing page memory in microelectronic devices." Vestnik of Russian New University. Series «Complex systems: models, analysis, management», no. 3 (October 8, 2023): 213–20. http://dx.doi.org/10.18137/rnu.v9187.23.03.p.213.

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Предлагается возможный способ организации страничного перепрограммируемого постоянного запоминающего устройства в микроконтроллерной технике. Целью статьи является формирование нового подхода к организации хранения произвольных блоков данных в памяти страничного типа. Применимость данного способа показана экспериментальным методом. В результате исследования сформирован принцип разбиения пространства памяти на сегменты и алгоритмы дефрагментации сегментов. This article proposes a possible way to organize a page PROM in microcontroller technology. The purpose of the article is to form a new appr

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Pandey, R. K., H. Stern, W. J. Geerts, et al. "Room Temperature Magnetic-Semicondcutors in Modified Iron Titanates: Their Properties and Potential Microelectronic Devices." Advances in Science and Technology 54 (September 2008): 216–22. http://dx.doi.org/10.4028/www.scientific.net/ast.54.216.

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The phenomenal growths of information technology and related fields have warranted the development of new class of materials. Multifunctional oxides, magnetic-semiconductors, multiferroics and smart materials are just a few examples of such materials. They are needed for the development of novel technologies such as spintronics, magneto-electronics, radhard electronics, and advanced microelectronics. For these technologies, of particular interest are some solid solutions of ilmenite-hematite (IH) represented by (1-x) FeTiO3.xFe2O3 where x varies from 0 to 1; Mn-doped ilmenite (Mn+3-FeTiO3) and

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