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Relevant bibliographies by topics / Package materials

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Academic literature on the topic 'Package materials'

Author: Grafiati

Published: 30 May 2022

Last updated: 31 July 2025

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Journal articles on the topic "Package materials"

1

De Kerpel, Laura, Barbara Kobuszewski Volles, and Anneleen Van Kerckhove. "Fats are Glossy but Does Glossiness Imply Fatness? The Influence of Packaging Glossiness on Food Perceptions." Foods 9, no. 1 (2020): 90. http://dx.doi.org/10.3390/foods9010090.

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This research brings together two research streams, one focusing on the influence of a diverse set of packaging attributes (e.g., shape, size, color, etc.) on perceptions of packaged food and the second one on the up- and downsides of using glossy materials, which are often studied in a non-food context. The current research deals with the influence of glossy (versus matte) food packages on consumers’ perceptions of the food inside the package. With one online survey and one quasi-experiment, we show that consumers draw inferences on the food’s fat level from the package surface, in that gloss

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Fabis, Philip M., and Henry Windischmann. "Thermal Management Enhancement for GaAs Devices Using CVD Diamond Heat Spreaders in a Plastic Package Environment." Journal of Electronic Packaging 122, no. 2 (1999): 92–97. http://dx.doi.org/10.1115/1.483139.

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Long term package reliability is becoming an increasing concern as IC clock speeds and power densities increase while simultaneously the package foot print decreases. Significant contributors to increasing the reliability and performance of plastic packages are reducing the package/junction temperature Tj and improving the integrity of the interfaces between the encapsulating polymer and the constituent package materials. CVD diamond, with its superior thermal conductivity, low density and high electrical resistivity offers an attractive alternative to traditional metal heat spreader materials

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Aihara, Takashi, Shingo Ito, Hideaki Sasajima, and Ken Oota. "Development of Reliability and Moldability on Fine Pitch Ball Grid Array by Optimizing Materials." Journal of Electronic Packaging 123, no. 1 (2000): 88–94. http://dx.doi.org/10.1115/1.1329129.

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The market for BGA packages is expanding all over the world, owing to the ease of its mounting onto the PC boards. On the other hand, BGA packages possess certain shortcomings compared to QFPs. Anti-solder crack performance on Fine Pitch BGA (=FPBGA) and warpage on Mold Array Package-BGA(=MAP-BGA) are significant disadvantages. To improve the performance of BGA packages, we studied various combinations of materials used for BGA package including molding compounds, die attach pastes, and substrates.

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SUZUKI, OSAMU. "Recent Advances in Underfill Materials." International Symposium on Microelectronics 2019, S2 (2019): S1—S15. http://dx.doi.org/10.4071/2380-4505-2019.1.invitedaihardware000014.

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Abstract Invited Session on FUTURE SEMICONDUCTOR PACKAGES FOR AI HARDWARE. Outline: Applications for Advanced Packaging; Global AI Computing Hardware Total Available Market (TAM); Die partitions; Defect Density; FC-BGA Families Trends; Technical Challenges of CUF; Underfills for Advanced Packaging; Severe KOZ on MCM; Bleed Out; Formulation Technique; Concerns during penetration; Chip package interaction (CPI) Challenges; and summary.

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Jen, Yi-Ming, Hsi Hsin Chien, Tsung-Shu Lin, and Shih Hsiang Huang. "Effect of Lid Materials on the Solder Ball Reliability of Thermally Enhanced Flip-Chip Plastic Ball Grid Array Packages." Key Engineering Materials 306-308 (March 2006): 1043–48. http://dx.doi.org/10.4028/www.scientific.net/kem.306-308.1043.

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This research studied the thermal fatigue life for eutectic solder balls of thermally enhanced flip-chip plastic ball grid array (FC-PBGA) packages with different lid materials under thermal cycling tests. Three FC-PBGA packages with different lid materials, i.e., Al, AlSiC, and Cu, were utilized to examine the lid material effect on solder ball reliability. The cyclic stress/strain behavior for the packages was estimated by using the nonlinear finite element method. The eutectic solder was assumed to be elastic-plastic-creep. The stable stress/strain results obtained from FEM analysis were ut

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Arshad, Khairul Mohd, Muhamad Mat Noor, Asrulnizam Abd Manaf, Hiroshi Kawarada, Shaili Falina, and Mohd Syamsul. "A Comparative Modelling Study of New Robust Packaging Technology 1 mm2 VCSEL Packages and Their Mechanical Stress Properties." Micromachines 13, no. 9 (2022): 1513. http://dx.doi.org/10.3390/mi13091513.

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Face recognition is one of the most sophisticated disciplines of biometric systems. The use of VCSEL in automotive applications is one of the most recent advances. The existing VCSEL package with a diffuser on top of a lens intended for automotive applications could not satisfy the criteria of the automotive TS16949: 2009 specification because the package was harmed and developed a lens fracture during 100 thermal cycle tests. In order to complete a cycle, the temperature rises from −40 °C to 150 °C and then rises again from 150 °C to 260 °C. The package then needs to be tested 500 times to en

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Verma, Ankita, Baqar Tabrez, Lam Duong, and Martin Wuest. "Manufacturability trade-offs of bare-die FCBGA package using thin or core-less substrate." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2017, DPC (2017): 1–26. http://dx.doi.org/10.4071/2017dpc-tha2_presentation3.

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With the increasing demand for thinner packages and higher electrical & thermal performance requirement bare-die packaging is an inevitable trend that is growing. The assembly process for manufacturing of bare die in thin or core-less substrate FCBGA packages can be challenging especially considering the effects of substrate warpage during flip chip bonding and the excessive warpage of the flip chip package. We are evaluating the manufacturing risks during bare-die FCBGA package assembly to eliminate package warpage failures using experimental techniques and improve the functional performa

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Usturoi, Alexandru, Cristina Simeanu, Marius Giorgi Usturoi, Marius Gheorghe Dolis, Roxana Nicoleta Ratu, and Daniel Simeanu. "Influence of Packaging Type on the Dynamics of Powdered Eggs Chemical Composition." Materiale Plastice 54, no. 2 (2017): 380–85. http://dx.doi.org/10.37358/mp.17.2.4855.

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The aim of the study was to investigate the dynamics of the main chemical compounds in the powdered eggs stored under constant environmental conditions (temperature=10�0.5oC; relative humidity=65�1%) and packaged in bags made of different plastic fabric (Lc group = high density polyethylene - HDPE; Lexp group = low density polyethylene - LDPE). The assessments were run to measure the inner water and dry matter contents, as well as the ash, proteins, lipids and nitrogen free extract levels. The analysis of data gathered throughout 90 days of storage suggested that the product packaged in low de

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Enomoto, Tetsuya, Mika Kobune, Kazutoshi Furuzono, Masahiro Matsunaga, Naoki Takahara, and Takashi Kawamori. "Highly Functional Materials for Advanced Package." Journal of Photopolymer Science and Technology 37, no. 3 (2024): 335–40. http://dx.doi.org/10.2494/photopolymer.37.335.

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Seok, Seonho. "Polymer-Based Biocompatible Packaging for Implantable Devices: Packaging Method, Materials, and Reliability Simulation." Micromachines 12, no. 9 (2021): 1020. http://dx.doi.org/10.3390/mi12091020.

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Polymer materials attract more and more interests for a biocompatible package of novel implantable medical devices. Medical implants need to be packaged in a biocompatible way to minimize FBR (Foreign Body Reaction) of the implant. One of the most advanced implantable devices is neural prosthesis device, which consists of polymeric neural electrode and silicon neural signal processing integrated circuit (IC). The overall neural interface system should be packaged in a biocompatible way to be implanted in a patient. The biocompatible packaging is being mainly achieved in two approaches; (1) pol

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Dissertations / Theses on the topic "Package materials"

1

Miranda, Michael Angelo. "Bio Based Active Barrier Materials and Package Development." University of Toledo / OhioLINK, 2016. http://rave.ohiolink.edu/etdc/view?acc_num=toledo1483450387453053.

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Simonson, Scott A. "Modeling of radiation effects on nuclear waste package materials." Thesis, Massachusetts Institute of Technology, 1988. http://hdl.handle.net/1721.1/36921.

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Abdi, Fatwa Firdaus. "Technology and market analysis of standard electronic photonic package." Thesis, Massachusetts Institute of Technology, 2006. http://hdl.handle.net/1721.1/37686.

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Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2006.<br>Includes bibliographical references (leaves 65-66).<br>Electronic industry will suffer a major turn around in the near future. The current infrastructure will no longer be able to support the increasing data rates. All the disadvantages of copper as current legacy are amplified with the level of bandwidth we are going to experience soon. On the other hand, photonic industry is in the need of finding a new demand source to be able to bring back the state of industry to the "boom" era. W

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Hara, Débora Harumi Suzuki. "Seleção de materiais para embalado de transporte de Mo-99." Universidade de São Paulo, 2015. http://www.teses.usp.br/teses/disponiveis/85/85134/tde-18082015-092143/.

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O transporte de materiais radioativos deve ser realizado em embalados capazes de suportar tanto condições normais, quanto acidentais de transporte. O objetivo deste trabalho foi a seleção de materiais que possam viabilizar a fabricação de um embalado para o transporte de substâncias que sejam fontes de alta radioatividade, em especial o Mo-99, cujo produto do decaimento radioativo é o Tc-99m, utilizado para fins diagnósticos na medicina nuclear. Para tanto, foi realizada a seleção dos possíveis materiais que podem ser utilizados para a fabricação de um embalado, com o auxílio do programa CES E

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Cole, David Andrew. "Towards the rational design of materials : the development of an integrated software package." Thesis, University of Surrey, 1992. http://epubs.surrey.ac.uk/843606/.

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Koh, Sau W. "Fatigue modeling of nano-structured chip-to-package interconnections." Diss., Atlanta, Ga. : Georgia Institute of Technology, 2009. http://hdl.handle.net/1853/28263.

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Thesis (M. S.)--Materials Science and Engineering, Georgia Institute of Technology, 2009.<br>Committee Chair: Rao R. Tummala; Committee Co-Chair: Ashok Saxena; Committee Member: Karl Jacob; Committee Member: Suresh Sitaraman; Committee Member: Thomas H. Sanders, Jr.

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Liu, Jin. "Zno nanowires for sensing and power generation for system-on-package technology." Diss., Atlanta, Ga. : Georgia Institute of Technology, 2008. http://hdl.handle.net/1853/26638.

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Thesis (Ph.D)--Electrical and Computer Engineering, Georgia Institute of Technology, 2009.<br>Committee Chair: Tummala, Rao; Committee Co-Chair: Wang, Zhong Lin; Committee Member: Brand, Oliver; Committee Member: Chang, Gee-Kung; Committee Member: Ghovanloo, Maysam; Committee Member: Wong, Ching-Ping. Part of the SMARTech Electronic Thesis and Dissertation Collection.

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Ray, Atris A. III. "Analytical and experimental analysis of heat transfer from current microelectronics package designs." Diss., Georgia Institute of Technology, 1998. http://hdl.handle.net/1853/19147.

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Paydenkar, Chetan S. "Flip chip assembly process development, process characterization, and reliability assessment of polymer stud grid array-chip scaled package." Thesis, Georgia Institute of Technology, 2001. http://hdl.handle.net/1853/19141.

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Dalmia, Sidharth. "Design and implementation of high-Q passive devices for wireless applications using System-On-Package (SOP) based organic technologies." Diss., Georgia Institute of Technology, 2002. http://hdl.handle.net/1853/15689.

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Books on the topic "Package materials"

1

Saggerson, Alan. Package holiday law: Cases and materials. XPL, 2008.

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2

China) China Academic Conference on Green Printing and Packaging Materials (2011 Harbin. Green printing and packaging materials: Selected, peer-reviewed papers from the 2011 China Academic Conference on Green Printing and Packaging Materials, August 20-23, 2011, Harbin China. Trans Tech Publications, Ltd., 2012.

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3

(Firm), Leading Edge Reports, ed. The Market for converted flexible packaging products and materials in North America. Leading Edge Reports, 1991.

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4

McCauley, Martin. Computer controlled materials testing package: The development of a package to verify Hooke's Law and find Young's Modulus. The Author], 1997.

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5

Associates, Keymark. North American flexible packaging strategies 2002: Markets, materials & machines : a comprehensive multiple client study. Keymark Associates, 1999.

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Canada. Industry, Science and Technology Canada. Kraft papers. Industry, Science and Technology Canada, 1988.

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7

Daum, Philip J., Christopher P. L. Barkan, Mohd Rapik Saat, and Laura E. Ghosh. Feasibility Study for Highway Hazardous Materials Bulk Package Accident Performance Data Collection. Transportation Research Board, 2013. http://dx.doi.org/10.17226/22649.

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8

Kara, Johnson, ed. Materials and design: The art and science of material selection in product design. 2nd ed. Elsevier/Butterworth-Heinemann, 2010.

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9

Ōtsuka, Kanji. Multilayer ceramic substrate-technology for VLSI package/multichip module. Elsevier Applied Science, 1993.

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10

Specialists in Business Information, inc., ed. SBI market profile. Specialists in Business Information, 1995.

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Book chapters on the topic "Package materials"

1

Griffin, Roger C., Stanley Sacharow, and Aaron L. Brody. "Packaging Materials." In Principles of Package Development. Springer Netherlands, 1985. http://dx.doi.org/10.1007/978-94-011-7382-7_3.

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2

Yang, Deren, Tong Yuan, and Xuegong Yu. "Package Structure Materials." In Handbook of Integrated Circuit Industry. Springer Nature Singapore, 2023. http://dx.doi.org/10.1007/978-981-99-2836-1_80.

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Griffin, Roger C., Stanley Sacharow, and Aaron L. Brody. "Materials and Package Testing." In Principles of Package Development. Springer Netherlands, 1985. http://dx.doi.org/10.1007/978-94-011-7382-7_5.

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Fruchtbaum, Jacob. "Package-Handling Conveyors." In Bulk Materials Handling Handbook. Springer US, 1988. http://dx.doi.org/10.1007/978-1-4757-4695-2_17.

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Azid, Ishak Abdul, C. P. Tan, Boon Leong Lee, K. N. Seetharamu, M. M. Ratnam, and M. V. V. Murthy. "Fracture Mechanic Analysis for Package Delamination." In Key Engineering Materials. Trans Tech Publications Ltd., 2005. http://dx.doi.org/10.4028/0-87849-978-4.844.

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Yeh, Meng Kao, and Wei-Xun Zhong. "Vibration Reliability in Flip Chip Package." In Key Engineering Materials. Trans Tech Publications Ltd., 2005. http://dx.doi.org/10.4028/0-87849-978-4.899.

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Störmer, Angela, and Keun Taik Lee. "Food Package Testing Authorities and Regulations." In Food Packaging Materials. CRC Press, 2017. http://dx.doi.org/10.4324/9781315374390-12.

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8

Nelson, Jayson J. "Tool Materials and Tooling Package Design." In Precision Lens Molding of Glass: A Process Perspective. Springer Singapore, 2020. http://dx.doi.org/10.1007/978-981-15-4238-1_2.

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Kim, Hee Seung, Mi Young Seo, and Ik Jin Kim. "Advanced Engineering Ceramics for Semiconductor Package Technology." In Key Engineering Materials. Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-410-3.1155.

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Xie, Kuo Jun, Chang Shun Jiang, Lin Zhu, and Hai Feng Xu. "Thermal Stress Analysis of MCM Package Using Diamond Material." In Key Engineering Materials. Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-456-1.2904.

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Conference papers on the topic "Package materials"

1

Gattu, V. K., J. L. Jerden, W. L. Ebert, Eric Lee, and J. E. Indacochea. "Electrochemical Corrosion Behaviors of Nuclear Waste Package Materials." In CORROSION 2021. AMPP, 2021. https://doi.org/10.5006/c2021-17009.

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Abstract The corrosion rates of alloys that will be present in spent fuel waste packages are being measured to represent the generation rates of H2 in a breached package under a range of Eh-pH conditions. The H2 concentration is a crucial parameter in repository performance analyses because the presence of even small amounts of H2 in a breached waste container can significantly decrease the oxidative-dissolution rate of directly-disposed spent UO2 fuel. Potentiostatic tests are being conducted in pH 4, 7, and 10 buffer solutions spiked with NaCl at several potentials that span the ranges of re

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Anantatmula, R. P., and R. P. Colburn. "Irradiation Corrosion of Waste Package Container Materials in Air/Steam Environment." In CORROSION 1992. NACE International, 1992. https://doi.org/10.5006/c1992-92072.

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Abstract A set of corrosion tests of the candidate waste container materials for the Basalt Waste Isolation Project (BWIP) was conducted in a moist air environment simulating the repository preclosure condition. The tests were performed over a four-month period with air, saturated with moisture at 50°C, passing through test chambers holding specimens at 150°C and 250°C. The test materials included A27 cast carbon steel, A387 ferritic steel, oxygen-free copper and cupronickel 90-10. Each material was tested both with and without basalt/bentonite packing material adjacent to the specimens. For e

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Scoppio, Lucrezia, Sten Axelsen, Emilia Imbimbo, Perry Nice, and Giuseppe Mortali. "Qualification of Scale Dissolver Acid Systems for 3CR and API 5CT Grade L80 13Cr Well Tubular Materials." In CORROSION 2018. NACE International, 2018. https://doi.org/10.5006/c2018-10969.

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Abstract Acid systems are used to improve productivity through either near-wellbore damage removal or through dissolving scale inside the wellbore during production. This paper describes the qualification methodology applied in the search for effective scale dissolvers/stimulation fluids with low corrosivity. The identification of suitable acid systems is becoming increasingly more challenging. Furthermore, the operators try to lower the cost of the acid treatment itself. This may be achieved through optimization of the inhibitor package, which constitutes a significant part of the chemical co

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Saha, Pranab, and John Chahine. "Sound Package Materials in Automobiles." In ASME 1996 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 1996. http://dx.doi.org/10.1115/imece1996-0525.

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Abstract Sound package materials have been used in automobiles for many years. Although the application of some of the key sound packages has not changed, the vehicle design and construction have changed significantly. Over the years, material and process development technology have changed, and health and environmental issues have raised different concerns. Global competition has also impacted the sound package development. These have provided challenges and opportunities to introduce new acoustical products and have forced the OEM to treat previously untreated noise paths with sound package

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Kyriazidis, Lucas L., Steve J. Hensel, and Jeff M. Jordan. "Interim Safe Storage of Radioactive Materials at the Savannah River Site." In ASME 2017 Pressure Vessels and Piping Conference. American Society of Mechanical Engineers, 2017. http://dx.doi.org/10.1115/pvp2017-65064.

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Storage of plutonium bearing materials at the US Department of Energy Savannah River Site (SRS) typically are packaged in DOE-STD-3013 welded containers which are stored in 9975 shipping packages. However, some materials are packaged in non-welded metal containers which consist of a can-bag-can configuration. These non-welded containers and the 9975 package provide safe containment of the plutonium bearing materials. Additionally, the materials must be stabilized such that adverse reactions do not occur during storage. Lastly, a surveillance program of these containers provides field and labor

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Sarihan, Vijay, Steven Xu, and Beth Keser. "Engineering New Package Ideal Materials Using Polymer Resins and Nanoparticles." In ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/ipack2007-33312.

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The trend in new electronic packages is to deliver smaller, thinner space-sensitive packages that meet or exceed customer package reliability expectations. This poses new material challenges in terms manufacturability and reliability. Size, space and manufacturability constrain typical packaging material choices available to meet the desired package performance. This often results in non optimal package performance and some times results in severe reliability challenges. Instead of compromising reliability expectations, the proposed approach engineers new materials to meet or exceed the desire

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Lin, Yuan-chang, Nguyen Tran, Yan Zhou, Yongzhi He, and Frank Shi. "Materials Challenges and Solutions for the Packaging of High Power LEDs." In 2006 International Microsystems, Package, Assembly Conference Taiwan. IEEE, 2006. http://dx.doi.org/10.1109/impact.2006.312173.

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Martinez, Oscar, Abiodun Adeniyi, Paul Nogradi, and Blake Van Hoy. "Regulatory Testing and 3D Scanning Methodology of the DPP-1 Type Shipping Container for NCT and HAC Tests." In ASME 2022 Pressure Vessels & Piping Conference. American Society of Mechanical Engineers, 2022. http://dx.doi.org/10.1115/pvp2022-86807.

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Abstract The safe transportation of radioactive material using appropriately designed and certified transportation packages is important for protecting the public and environment. In the United States, the US Department of Transportation (DOT) regulates all transportation of radioactive material with input from the US Nuclear Regulatory Commission. All packages that contain radioactive materials must be transported and regulated by the requirements set by the DOT Class 7 transportation of hazardous material. Federal regulations place strict administrative controls on the transport of radioacti

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Yen, Tzu-yin, Chung-mao Yeh, Chin-ching Huang, and Min-te Tu. "Development of Optimizing Process Flow and Materials Selection for Optical Device Packages." In 2006 International Microsystems, Package, Assembly Conference Taiwan. IEEE, 2006. http://dx.doi.org/10.1109/impact.2006.312179.

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Jung, Henry H., Sai Ankireddi, Stanley Pecavar, and James Jones. "Influence of Package-Sink Interface Materials on Die Performance and Reliability." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35304.

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For high-power electronic packages, it is generally accepted that the package-sink interface materials used in the thermal solution influence hot-spot temperature(s) and junction-to-ambient thermal resistance. In this article we show how these package-exterior materials can noticeably influence across-die temperature gradients also. The numerical results reveal that the across-die thermal gradient can nearly double over a narrow range of conductivities typical of commercially available package-sink interface materials. Results show that the chip hot-spot temperature can be reduced 4 to 7 C by

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Reports on the topic "Package materials"

1

VENKATARAMAN PASUPATHI. WASTE PACKAGE MATERIALS SELECTION ANALYSIS. Office of Scientific and Technical Information (OSTI), 1997. http://dx.doi.org/10.2172/778855.

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S. Arthur. Aqueous Corrosion Rates for Waste Package Materials. Office of Scientific and Technical Information (OSTI), 2004. http://dx.doi.org/10.2172/837697.

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Pasupathi, V. Waste Package Supports and Sorptive Inverts--Materials Selection. Office of Scientific and Technical Information (OSTI), 1997. http://dx.doi.org/10.2172/763063.

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Simonson, S. A. Modeling of radiation effects on nuclear waste package materials. Office of Scientific and Technical Information (OSTI), 1988. http://dx.doi.org/10.2172/6305687.

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GREGORY E. GDOWSKI. HUMID AIR CORROSION OF YMP WASTE PACKAGE CANDIDATE MATERIALS. Office of Scientific and Technical Information (OSTI), 1998. http://dx.doi.org/10.2172/776468.

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G.M. Gordon. Update on Waste Package Materials Selection, Heat Treatment and Degradation Modes. Office of Scientific and Technical Information (OSTI), 2006. http://dx.doi.org/10.2172/893376.

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G.M. Gordon, P.L. Andresen, and L.M. Young. The Probabilistic Nature of Environmental Cracking in Candidate Waste Package Materials. Office of Scientific and Technical Information (OSTI), 2001. http://dx.doi.org/10.2172/805432.

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Gwinn, K. W., R. E. Glass, and K. R. Edwards. Over-the-road tests of nuclear materials package response to normal environments. Office of Scientific and Technical Information (OSTI), 1991. http://dx.doi.org/10.2172/140821.

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J.N. Bailey, J.D. Cloud, T.E. Rodgers, and S.E. Summers. Evaluation of the Final Report: Waste Package Materials Performance Peer Review Panel. Office of Scientific and Technical Information (OSTI), 2002. http://dx.doi.org/10.2172/859150.

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Van Konynenburg, R. A., and P. G. Curtis. Corrosion test on candidate waste package basket materials for the Yucca Mountain project. Office of Scientific and Technical Information (OSTI), 1996. http://dx.doi.org/10.2172/231378.

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