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1
Jin, Ran. "Variation modeling, analysis and control for multistage wafer manufacturing processes." Diss., Georgia Institute of Technology, 2011. http://hdl.handle.net/1853/41077.
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Geometric quality variables of wafers, such as BOW and WARP, are critical in their applications. A large variation of these quality variables reduces the number of conforming products in the downstream production. Therefore, it is important to reduce the variation by variation modeling, analysis and control for multistage wafer manufacturing processes (MWMPs). First, an intermediate feedforward control strategy is developed to adjust and update the control actions based on the online measurements of intermediate wafer quality measurements. The control performance is evaluated in a MWMP to transform ingots into polished wafers. However, in a complex multistage manufacturing process, the quality variables may have nonlinear relationship with the parameters of the predictors. In this case, piecewise linear regression tree (PLRT) models are used to address nonlinear relationships in MWMP to improve the model prediction performance. The obtained PLRT model is further reconfigured to be complied with the physical layout of the MWMP for feedforward control purposes. The procedure and effectiveness of the proposed method is shown in a case study of a MWMP. Furthermore, as the geometric profiles and quality variables are important quality features for a wafer, fast and accurate measurements of those features are crucial for variation reduction and feedforward control. A sequential measurement strategy is proposed to reduce the number of samples measured in a wafer, yet provide adequate accuracy for the quality feature estimation. A Gaussian process model is used to estimate the true profile of a wafer with improved sensing efficiency. Finally, we study the multistage multimode process monitoring problem. We propose to use PLRTs to inter-relate the variables in a multistage multimode process. A unified charting system is developed. We further study the run length distribution, and optimize the control chart system by considering the modeling uncertainties. Finally, we compare the proposed method with the risk adjustment type of control chart systems based on global regression models, for both simulation study and a wafer manufacturing process.
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Liu, Jia. "Heterogeneous Sensor Data based Online Quality Assurance for Advanced Manufacturing using Spatiotemporal Modeling." Diss., Virginia Tech, 2017. http://hdl.handle.net/10919/78722.
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Online quality assurance is crucial for elevating product quality and boosting process productivity in advanced manufacturing. However, the inherent complexity of advanced manufacturing, including nonlinear process dynamics, multiple process attributes, and low signal/noise ratio, poses severe challenges for both maintaining stable process operations and establishing efficacious online quality assurance schemes.
To address these challenges, four different advanced manufacturing processes, namely, fused filament fabrication (FFF), binder jetting, chemical mechanical planarization (CMP), and the slicing process in wafer production, are investigated in this dissertation for applications of online quality assurance, with utilization of various sensors, such as thermocouples, infrared temperature sensors, accelerometers, etc. The overarching goal of this dissertation is to develop innovative integrated methodologies tailored for these individual manufacturing processes but addressing their common challenges to achieve satisfying performance in online quality assurance based on heterogeneous sensor data. Specifically, three new methodologies are created and validated using actual sensor data, namely,
(1) Real-time process monitoring methods using Dirichlet process (DP) mixture model for timely detection of process changes and identification of different process states for FFF and CMP. The proposed methodology is capable of tackling non-Gaussian data from heterogeneous sensors in these advanced manufacturing processes for successful online quality assurance.
(2) Spatial Dirichlet process (SDP) for modeling complex multimodal wafer thickness profiles and exploring their clustering effects. The SDP-based statistical control scheme can effectively detect out-of-control wafers and achieve wafer thickness quality assurance for the slicing process with high accuracy.
(3) Augmented spatiotemporal log Gaussian Cox process (AST-LGCP) quantifying the spatiotemporal evolution of porosity in binder jetting parts, capable of predicting high-risk areas on consecutive layers. This work fills the long-standing research gap of lacking rigorous layer-wise porosity quantification for parts made by additive manufacturing (AM), and provides the basis for facilitating corrective actions for product quality improvements in a prognostic way.
These developed methodologies surmount some common challenges of advanced manufacturing which paralyze traditional methods in online quality assurance, and embody key components for implementing effective online quality assurance with various sensor data. There is a promising potential to extend them to other manufacturing processes in the future.Ph. D.
3
Kieffer, Daniel W. "Feasibility of recycling air conditioner condensate for use as process water for a manufacturing facility." Oklahoma City : [s.n.], 2008.
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Heber, Dominici Victoria Blanca. "Design Improvement of a Water Recirculation System for a Cooling Process in a Tobacco Manufacturing Plant." Master's thesis, Alma Mater Studiorum - Università di Bologna, 2019.
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In the industrial sector, it is possible to observe unexpected behaviours of processes, which were not anticipated in the design stage. Such is the case of a secondary cooling process existing within a tobacco manufacturing plant, which was initially designed to cool and recover clean process water with chilled water for posterior recirculation into the main cooling process. It has been observed that under the design flowrates the plate and frame heat exchanger where the process water is cooled is rapidly clogged by suspended solids coming from the main cooling process, resulting in both high maintenance costs and frequent product ion downtime due to necessary intervention for mechanical cleaning.
The aim of this thesis project is to evaluate and design process improvements providing sustainable solutions, reducing the operative costs existing nowadays and avoiding any damage on the plate and frame heat exchanger.
Any process design solution asks for a capital investment, which was also considered in the overall analysis of the alternatives within this study.
Within the evaluation of the possible modifications, solid/liquid separation was mostly studied, together with the selection and design of an appropriate heat exchanger for the given process. After a preliminary screening, a reduced number of alternatives were analysed in detail to assess their possible application. Few alternatives to solving the problem have been studied, in spite of having a wide variety of options.
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Grossmann, Anja. "Influence of manufacturing process parameters on the physical properties of an oil-in-water cream." [S.l. : s.n.], 2007.
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6
George, Jonathan Alan. "Development of a Plasma Arc Manufacturing Process and Machine to Create Metal Oxide Particles in Water From Wire Feedstock." Diss., CLICK HERE for online access, 2010. http://contentdm.lib.byu.edu/ETD/image/etd3494.pdf.
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Vay, Kerstin. "Analysis and control of the manufacturing process and the release properties of PLGA microparticles for sustained delivery of a poorly water-soluble drug." Diss., lmu, 2012. http://nbn-resolving.de/urn:nbn:de:bvb:19-150495.
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Vay, Kerstin [Verfasser], and Wolfgang [Akademischer Betreuer] Frieß. "Analysis and control of the manufacturing process and the release properties of PLGA microparticles for sustained delivery of a poorly water-soluble drug / Kerstin Vay. Betreuer: Wolfgang Frieß." München : Universitätsbibliothek der Ludwig-Maximilians-Universität, 2012. http://d-nb.info/1029040303/34.
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Davico, Luca [Verfasser], Eckhard [Gutachter] Weidner, and Marcus [Gutachter] Petermann. "Manufacturing and characterization of microcapsules obtained by the PGSS process from water in oil emulsions stabilized by emulsifiers / Luca Davico ; Gutachter: Eckhard Weidner, Marcus Petermann ; Fakultät für Maschinenbau." Bochum : Ruhr-Universität Bochum, 2019. http://d-nb.info/1191481611/34.
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Vacek, Jan. "Využití srážkových vod v průmyslovém objektu." Master's thesis, Vysoké učení technické v Brně. Fakulta stavební, 2016. http://www.nusl.cz/ntk/nusl-240371.
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Diploma thesis contains a design the plumbing and gas installations in the industrial building. The theoretical part deals with the use of rainwater in the building as the process water and the experimental determination of the flow rate and water needs for the manufacturing and storage hall with built-office. The calculation part deals with the design of variants of plumbing and gas installations in the building manufacturing and storage hall with built-office. The practical part contains a design and project documentation of selected variants plumbing and gas installations in the manufacturing and storage hall with built-office, and the use of rainwater in this type of building.
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Fan, Chih-Min, and 范治民. "Statistical Process Control of Wafer Acceptance Test Data in Semiconductor Manufacturing." Thesis, 2000. http://ndltd.ncl.edu.tw/handle/82988015483285096801.
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博士國立臺灣大學
電機工程學研究所
88
This thesis designs a Statistical Process Control (SPC) scheme for end-of-line Wafer Acceptance Test (WAT) data. Due to production scheduling and dispatching policies, there are two complicating features of WAT data generation: multiple streams of machines for one product type and disorder of lot sequences from its in-line lot sequences. Under the multiple-stream (MS) and sequence-disorder (SD) effects, a process shift caused by one machine at an in-line step will not only change the mean but also increase the variance of WAT data sequence. One current practice of end-of-line SPC is to review the Cpk values of key WAT parameters every week. The philosophy of this approach is to reduce the MS and SD effects by plotting the Cpk data in a larger batch size such as lot data of one week so that the combined changes in process mean and variance could be identified more easily. However, in the Weekly Cpk Review approach, either control limit or batch size is usually determined empirically, which could degrade the detection performance. There should be a more rigorous rule for the design of these control parameters under different process conditions. To overcome the shortages of Cpk review approach, we first adopt the standard, rolling review based, Shewhart and EWMA control charts to monitor WAT data sequence, with a focus on studying the relationship among scheme parameters, process shift size, and detection capability under the MS and SD effects. To maintain the features of Cpk review approach, we also develop a new control chart of EWMC (Exponentially Weighted Moving Cpk) for jointly monitoring the process mean and variance. By exploiting the advantages of Shewhart, EWMA, and EWMC control charts, an integrated SHEWMAC scheme with systematic parametric design approach is developed for WAT trend detection. The SHEWMAC consists of three modules: Input Data Normalization, Control Charting, and Robust Parameter Generation (RPG). In a foundry fab, daily generation of WAT data of each product type may be statistically “rare”. To increase the sample size, WAT data inputs are first normalized so that data of different products belonging to the same processing technology can be aggregated to reach a scale of statistical significance. A normalized data sequence is then monitored lot-by-lot by a Shewhart chart for large shift detection, an Exponentially Weighted Moving Average (EWMA) chart for small shift detection, and an Exponentially Weighted Moving Cpk (EWMC) control chart for detecting the combined changes in mean and variance. The parameters for Control Charting consist of the weighting factor, Shewhart control limit, EWMA control limit, and EWMC control limit, all of which come from the RPG. The RPG takes the requirement of false alarm rate, specification limit, and the possible range of process conditions in a fab as design inputs. The process conditions are defined for each process step, which consist of the sequence-disorder range, number of machines, and potential magnitude of process shift. Given the design inputs, the search space of RPG is first defined and quantatized. Then, by approximating the combined Shewhart-EWMA charts as a discrete Markov chain, the feasible Shewart-EWMA parameters are calculated via a bisection procedure. Based on simulation, the feasible EWMC control limit corresponding to each set of feasible Shewhart-EWMA parameters is also calculated by the bisection procedure. By screening all the quantatized feasible parameters, the optimal parameters for individual process conditions are calculated. The set of robust parameters is finally selected as the one yielding the smallest detection delay in the worst case. Simulation results show that a smaller weighting factor (a larger batch size) is needed for SHEWMAC to reveal the underlying WAT trend as compared to that generally adopted in EWMA chart without considering MS and SD effects. Also, to exploit the information of variance increase using EWMC chart and to maintain the false alarm rate, the control limits of Shewhart and EWMA charts should be relaxed and compensated by a narrower EWMC-in-control-region. It is validated that the performance of SHEWMAC is robust against the WAT specification limits. The SHEWMAC with robust parameters reduces about 15% of the time in detecting WAT trends as compared to the Exponentially Weighted Mean Square (EWMS) and combined Shewhart-EWMA schemes generally used for trend detection. The fab data validation shows that SHEWMAC is practical for WAT trend detection, facilitates the first-cut diagnosis, and is complementary to the existing in-line SPC for process integration.
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TOU, EN-HSU, and 竇恩勗. "Neural Network Prediction Model for Ion Implantation Correctness in Wafer Manufacturing Process." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/259c4x.
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碩士中華大學
科技管理學系碩士班
101
In the past few decades the rapid development of semiconductor manufacturing process improvements has led to the speedy growth of many modern industries and imports them into market. Semiconductor industry has therefore been regarded as an indicator of modern industries of science and technology. The semiconductor process yield is one of the most crucial indicators to the corporate profits of this industry. The yield can be defined as a percentage of success of the total number of all production. The yield management but rather refers to the general term for the entire relevant process to the integrated analysis of the mass data produced by the semiconductor process, and to the achievements of yield improvements and predictions. While in the wafer manufacturing process, the correct degree of ion implantation, it is the key to good or bad influence of the yield. Using the back-propagation artificial neural network (BP-ANN) with its advantages of learning and fault tolerance, we build an effective prediction model to forecast the implantation correct level of the Ion Implanter. We first let the actual measured electrical parameter values of various functional modules of Ion Implanter to go through statistical analysis and regression analysis for data preprocessing. The screened result of the data preprocessing can be used as the input variables to the BP-ANN model to effectively control the complexity and accuracy of the constructed prediction model. Then we build a BP-ANN model to accurately predict the value of the indicator variable of which the implantation correct level of the Ion Implanter is measured. According to the value of this indicator variable the implant results of the Ion Implanter can be categorized as ‘Normal’ or ‘Bad’ or ‘Slightly’. A comparative study of whether to do data preprocessing for the accuracy of the proposed BP-ANN model has been performed in this thesis. We observed that if not to do data pre-processing, it will cause a serious error of prediction. Test result verifies the accuracy of the proposed prediction model, the error between the predictive value and the actual value may be less than 0.4%, after data preprocessing. Through a sensitivity analysis of the neural network, we further identify those electrical parameters that are the most important influence factors on the ion implantation result.
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徐方元. "Comparing Quality Cost of Different Monitoring Methods in Silicon Wafer Manufacturing Process." Thesis, 2007. http://ndltd.ncl.edu.tw/handle/10067024391063424385.
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碩士國立交通大學
管理學院碩士在職專班管理科學組
96
Integrated circuit virtually created the foundation for the entire field of modern microelectronics. Silicon wafer is one of the most important raw materials for IC. Silicon wafer manufacturing is a mature industry and there are around 10 vendors in the world. Each vendor’s wafer has similar quality level for IC Fab and there is almost no barrier for vendor replacement. Under the globalize competition and in the trend of micro profit, cost reduction is a key factor for silicon wafer suppliers. In silicon wafer manufacturing process, the surface metallic contamination analysis is a destructive inspection. Therefore, 100% inspection is impossible and statistical process control is a suitable tool for process monitoring. By comparing the different items of quality costs among three kinds of SPC monitoring method, this study establishes formulas for quality cost difference. It is also discussed which methods has the lowest quality cost while the abnormality frequency changed. Finally, this study practically applies related data from T Company to those formulas. The result can be a reference for silicon wafer manufacturing industry to select method with lowest quality cost.
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CHEN, PEL-LAN, and 陳佩嵐. "Procedure of Monitoring Wafer Defects and Defect Clustering on in Integrated Circuits Manufacturing Process." Thesis, 2003. http://ndltd.ncl.edu.tw/handle/98657708930371286270.
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碩士國立交通大學
工業工程與管理系
91
Integrated circuits manufacturing companies usually use the c-chart to control the wafer defects. The clustering of defects on a wafer becomes evident when the wafer size increases. The clustering phenomenon causes the Possion based c-chart invalid. Many modified c-charts have been developed to reduce the false alarms caused by defect clustering. However, there are still some drawbacks in employing the modified c-charts. This study proposed a statistical process control procedure for monitoring wafer defects and defect clustering simultaneously. The method employs hierarchical clustering analysis to remove the interaction of defect clustering and defect counts and obtain the modified defect counts to construct the c-chart. In addition to the c-chart for the modified defect counts, this study uses a cluster index, which does not require any assumption on the distribution of defects, to establish a procedure for monitoring defect clustering. Finally, a real-world case and a simulated case are presented to verify the effectiveness of the proposed procedure.
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Chen, Hsiao-Chun, and 陳曉君. "A Effect of Agile Workforce Scheduling Problem in TOC Environment-A Wafer Manufacturing Process Example." Thesis, 2003. http://ndltd.ncl.edu.tw/handle/98446485741988364252.
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碩士華梵大學
工業管理學系碩士班
91
Due to the massive implementation of automation machines, manufacturing productivity has increased drastically. Meanwhile, the change of work contents has gradually reduced labor demand. The use of “a single multi-functional operator serving several different machines” has become the norm of modern shop floor. Also the increasing acceptance of “Theory of Constraints” has a major impact to managing shop floor. With the increasing successful implementations on bottleneck oriented operations, the non-capacity constraint resources should subordinate themselves to the capacity constraint resource, many successful shop floors further demonstrate that with the use of “one multi-skilled operator serving different multi-machine” system, further job enlargement and more flexibility for utilizing human resource is achievable. The research focuses on exploring the feasibility of finding minimum number of multi-skilled labor that can satisfy the targeted throughput of a TOC oriented system with two types, an even and a lump-sum, of material releasing schemes. Based on the different skills each individual worker owns, the solution procedures use the concept of union and complement skill sets to determine either a feasible employee schedule or a needed skills list that must be acquired in order to run the system smoothly. The research also suggests the better learning orders for those less skilled workers so they can learn new skills in a manner that the system demand is always met. The simulation results indicate that without loosing any throughput, the lump-sum releasing scheme uses only 5 workers, one less than the even releasing scheme. Also the worker utilization of the lump-sum releasing scheme is also 24.37% higher than that of the other scheme.
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Lo, Mei-Fang, and 羅梅芳. "Constructing Raw Wafer Quality Management System and Reducing Advanced/Special Process Developing Period on Semiconductor Manufacturing." Thesis, 2017. http://ndltd.ncl.edu.tw/handle/eyhca2.
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碩士國立清華大學
經營管理碩士在職專班
105
Abstract Wafer, the substrate of integrated circuit (IC), decides the quality of final product performance from its intrinsic properties. Currently, most semiconductor manufacturing FABs use COA (Certificate of Authenticity) as accepted criteria to wafer suppliers. During the more complicated and advanced technology going, the raw wafers with same COA perform different results after hundreds of manufacturing and thermal process. The unpredictable failure reveals the deficiency of overall optimized certification for raw wafers. This study aims to employ UNISON decision framework to develop a raw wafer quality management system for reducing advanced/special process developing period on semiconductor manufacturing. For mature products, here demonstrates an optimized procedure for wafer CoA key parameters improvement. This can very help to accurate the right root cause and fix problems in a short time. Also, for specialty and advanced products, this study finds the most related wafer parameters from historic experience with DOE analysis and significantly reduces developing cycle and useless guess.
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Lu, Chun-Yao, and 呂春瑤. "Correlation Analysis between Wafer Acceptance Test and In-line Data for Process Control in Semiconductor Manufacturing." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/35156604500826405916.
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碩士國立臺灣大學
工業工程學研究所
97
Yield ramping and feature size shrinking continuously lead to tightening of process control. In semiconductor fabrication, process control is a key element for successful IC manufacturing. As IC technology advances towards the nanometer era, the concept of advanced process control (APC) has been proposed and implemented in semiconductor manufacturing. Feed-forward control is one of the APC strategies for manufacturing processes. Correlation analysis of Wafer Acceptance Test (WAT) data and In-line data is needed for yield control and fault diagnosis of the fabrication processes. Through the measurement data and correlation analysis, statistical methods are used to characterize the process status and establish a correlation model. Currently, regression analysis is one of the popular correlation analysis methods for fitting correlation models between WAT and In-line data with “single-model” assumption. However, “multiple models” due to model indicator which is an index to separate multiple models and could be the recipe names, equipment/chamber IDs, and results in the unsatisfied R-square performance. Unfortunately, the model indicator may not manifest itself on the data. Therefore, the model indicator always does not appear in the dataset and it is a “hidden variable.” To cope with the multi-model issue in correlation analysis, the main challenge is neither hidden variables nor regression parameters is pre-known. In this research, we extend the Expectation-Maximization (EM) algorithm for identifying the multiple regression models. The key ideas are: given the initial solution first, then iteratively estimate the hidden variables and regression parameters until convergence. However, direct application of the standard EM algorithm for regression has two challenges: local optimum and overfitting. Local optimum comes from a greedy search strategy such as EM algorithm whose performance depends on the initial solution and it is easy to converge with one of the numerous local minima. To solve the local optimal problems, we try many different initial solutions to find the effective local optimum which approximates global optimum. Overfitting is a common problem in statistics and data mining that gives data too much explanation including minor fluctuations or random error in the data. The outcome of the multi-model is definitely better than single-model, but now there is no measurement and metric capable of determining if the model is single-model or two-model. So we need to use statistical metric for evaluating the single-model against the multi-model. Finally, we develop an EM-Based-Regression (EMR) algorithm which contains above ideas to resolve these two problems. To validate global optimum approximation and overfitting avoidance of EMR algorithm, we conduct simulations to evaluate performance. Three types of simulation models are designed: single model, parallel two models, and cross two models. For global optimum approximation, we propose likelihood as the criteria of convergence estimation as the variation of likelihood is minor and local optimum selection when likelihood maximization. Then confident interval of the estimated regression parameters covers setting of model coefficients, so there is high probability to approach global optimum. For the overfitting problem, we compare the performance of several statistical metrics, which consists of F-statistic, Bayesian Information Criterion (BIC), and empirical F-statistic, to evaluate the statistic significance. In conclusion, the empirical F-test and the BIC-test achieve a better performance in distinguish model significance, and control the false identification rate (or Type I Error) and Miss Detection Rate (or Type II Error) less than 0.05.
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Ying-HsunChen and 陳盈勛. "A Study on the Customer Complaint Response Process using Value Stream Mapping and 8D for Semiconductor Wafer Manufacturing." Thesis, 2019. http://ndltd.ncl.edu.tw/handle/rrbfc2.
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碩士國立成功大學
工程管理碩士在職專班
107
According to foundry and industry overview, we focus on improving customer complaints about service process issues to reduce the impact of customer complaints on company operations. In the semiconductor industry, the overlapping of customers is getting higher and higher, and the way to improve competitiveness is not only to improve production technology and to reduce costs, but how to maintain customers is also a very important issue. Suppliers or manufacturers should do everything they can to meet customer needs and improve their competitiveness by reducing the impact of customer complaints. This study explores the seven major wastes, value streams in the principles of lean management, and uses tools such as ECRS, 8D and 5WHY to improve the customer complaint process of case company. After observing the case company complaint process, the value stream map is used to identify unnecessary waste and improvement opportunities in the operation process. Eliminate unnecessary waste, import new processes and tools, reduce the processing time of the case company's customer complaint process by 40%, and reduce the customer re-complaint rate from 45% to 25%, effectively improving customer service quality. Through the above methods, it is actually applied to the case company customer complaint process, and the initial improvement results are effective. In this way, enterprises can review the customer complaint handling workflow to meet customer needs, maintain good customer relationships, and enhance the company's competitiveness.
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Chen, Chao-Chun, and 陳昭君. "Planning and Implementation Procedures of Manufacturing Process Internal Audit for ISO/TS16949 －Case Study of a Foundry Wafer Plant." Thesis, 2007. http://ndltd.ncl.edu.tw/handle/99447452582512997063.
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碩士國立交通大學
管理學院碩士在職專班工業工程與管理組
95
ABSTRACT Companies worldwide are choosing to outsource manufacturing to China. This move has created an unprecedented challenge to Taiwanese manufacturing companies. The difference between “made in China” and “ made in Taiwan” is that the quality of products and services in Taiwan surpass those in China. Quality is central to the survival enterprises, and is the principal index of customer satisfaction. The best strategy for attaining and maintaining competitive advantage is to maximize product and service quality. Taiwanese manufacturing companies require an efficient quality certification system for their products and services to maintain their competitive advantage. As the QS-9000 system was invalidated in December 2006, the ISO/TS16949 system has become the required certification for quality management system in automotive supply chains. This certification promotes the quality of products and services continuously, and enhances customer satisfaction. Manufacturing companies with the ISO/TS16949 certification can acquire business from automotive industries worldwide. The most effective method of quality system evaluation and monitoring is the quality audit. According to IS/TS16949:2002 requirements, internal audits must include the following three audits: quality management system audit; manufacturing process audit; and, product audit. The ISO/TS16949 quality management system is concerned with the monitoring and planning of an internal audit of manufacturing processes, emphasizing failure prevention. The purpose of this audit is to decrease quality variation in manufacturing processes associated with materials and parts manufacturers in the automotive industry. The most important of these three audit types is the manufacturing process audit. This study analyzes international standards associated with the manufacturing process audit in the ISO/TS16949 quality management system. Experts are interviewed to identify appropriate planning and implementation procedures of manufacturing process internal audit for ISO/TS16949. This investigation uses the case study of a foundry wafer plant located in Hsinchu to verify the effectiveness of the planning and implementation procedures for a manufacturing process audit. This study provides a reference for automotive manufacturing companies applying to the ISO/TS16949 system. Moreover, this study improves the performance of the internal audit system. The proposed procedure can be employed to manufacturers in automotive supply chains, and to all manufacturers that seek to improve the performance of their internal audit system for Taiwanese manufacturing companies, to enhance the quality of products made in Taiwan and improve Taiwan’s global competitiveness.
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Ku, Ting-Yu, and 古庭諭. "Multi-Plant and Multi-Stage Manufacturing Process Order Assignment for The Semiconductor of Wafer Probing and IC Packaging and Testing Industry." Thesis, 2008. http://ndltd.ncl.edu.tw/handle/06782454592114668847.
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碩士元智大學
工業工程與管理學系
96
While the semiconductor industry is mature today, it also push forward the orders increasing in the Wafer Probing, IC Packaging and Testing industries. In order to satisfy customer’s demand, companies became multi-plant production from single-plant production and achieve the minimizing of the total cost by sharing the capacity resource. A company can deploy the capacity through applicable order assignment to avoid losing a chance to get great profit. Under these considerations of different production limit and cost, it is important to develop a model to assign orders properly based on the multi-plant and multi-stage manufacturing process. In this research, a multi-plant and multi-stage manufacturing process order assignment model is applied to wafer probing, IC packaging and IC final testing of industry by binary integer programming. According to the constraints which are capacity limitation, production limitation, process capability, the supply between up-stream and down-stream manufacturing process, unit change and manufacturing cost, the orders will distribute to produce in the suitable factories and achieve the objective that is to minimize the total production cost, outsourcing cost, lateness cost and idle cost. This research uses three real examples to verify the feasibility of the model. In the minimizing of the total production, we can find out the optimal order assignment, the Wafer Probing, IC Packaging and IC final testing stage volume of orders producing, outsourcing and order lateness. The result could help management arrange the detail production scheduling and make decisions.
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Ke, Jian-Jung, and 柯建仲. "A Study of Using TOC to Improve Performance of A Multi-stage Multi-Machine Serial Line — A Wafer Manufacturing Process Example." Thesis, 2002. http://ndltd.ncl.edu.tw/handle/12343901142405650172.
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碩士華梵大學
工業管理學系碩士班
90
This research explores the possibility of using the principles of TOC to manage a general three-stage serial production line whose bottleneck shifts from one station to another frequently due to complicated product mix. Three multi-machines, batch-processing workstations with similar capacities were explored in the research. According to the nature of batch operations, these stations are classified as undividable serial batch, dividable serial batch and dividable parallel batch operations for the first, second and third stations, respectively. With wafer manufacturing process as an example, the research uses three basic steps derived form the TOC thinking process to resolve constraints. In the” What to Change?” step, a current reality tree (CRT) was developed to find out the core problem that constrains the system was “mix up the material is not allowed”, which was a policy constraint. In the next “What to Change to?” step, conflict resolution diagram (CRD) was used to resolve the conflict between the core problem and the proposed alternative. Finally in the last “How to Cause the Change” step, several simulation studies were conducted to validate the effectiveness of using TOC in shop floor management under no “shifting bottleneck” assumption. The research results indicate that it is very effective to use TOC thinking process for analyzing system constraints and developing conflicts resolution control principles. After removing the main policy constraint on the dividable serial batch workstation, with the use operational strategies such as lot splitting, parallel batch processing and setup reduction, the system can significantly increase its throughput and reduces its cycle time.
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Lee, Hyung Joo 1979. "Advanced process control and optimal sampling in semiconductor manufacturing." 2008. http://hdl.handle.net/2152/17929.
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Semiconductor manufacturing is characterized by a dynamic, varying environment and the technology to produce integrated circuits is always shifting in response to the demand for faster and new products, and the time between the development of a new profitable method of manufacturing and its transfer to tangible production is very short. The semiconductor industry has adopted the use of advanced process control (APC), namely a set of automated methodologies to reach desired process goals in operating individual process steps. That is because the ultimate motivation for APC is improved device yield and a typical semiconductor manufacturing process can have several hundred unit processes, any of which could be a yield limiter if a given unit procedure is out of control. APC uses information about the materials to be processed, metrology data, and the desired output results to choose which model and control plan to employ. The current focus of APC for semiconductor manufacturers is run-to-run control. Many metrology applications have become key enablers for the conventionally labeled “value-added” processing steps in lithography and etch and are now integral parts of these processes. The economic advantage of effective metrology applications increases with the difficulty of the manufacturing process. Frequent measurement facilitates products reaching its target but it increases the cost and cycle time. If lots of measurements are skipped, the product quality does not be guaranteed due to process error from uncompensated drift and step disturbance. Thus, it is necessary to optimize the sampling plan in order to quickly identify the sources of prediction errors and decrease the metrology cost and cycle time. The goal of this research intend to understand the relationship between metrology and advanced process control (APC) in semiconductor manufacturing and develop an enhanced sampling strategy in order to maximize the value of metrology and control for critical wafer features.text
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YEN, CHANG-YOU, and 顏彰佑. "Process Technology Associated with Manufacturing Water Soluble Fiber-enriched Toasts." Thesis, 2018. http://ndltd.ncl.edu.tw/handle/w7eqqz.
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碩士弘光科技大學
食品科技所
106
Due to the current insufficiency of dietary fiber intake in Taiwan and the changes in Western dietary patterns, we started to develop dietary fiber fortification from the most common toast. The purpose of this study was to try to add water-soluble dietary fibers such as indigestible dextrin and Xanthan gum to toast to partially replace flour, to develop water-soluble dietary fiber-fortified toast, and to increase the dietary fiber intake of our country's people. Intake. Preliminary tests showed that Fibersol replaced 5% flour-made toast and Xanthan Gum replaced 1% flour-made toast were the better formula. The specific volume and finished product appearance were all closer to the traditional toast formula group. The final tests selected five groups of formula, and then the physical and chemical properties, texture and sensory Evaluations were conducted for more complete evaluation. The final test showed that Fibersol replaced 1% flour and Xanthan Gum replaced 1% flour made toast. It's specific volume, finished appearance, physical and chemical properties, texture, and sensory evaluation were closer to the traditional formula group.
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Schoene, Clare Butler 1979. "Electrical parameter control for semiconductor manufacturing." Thesis, 2007. http://hdl.handle.net/2152/3669.
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The semiconductor industry is highly competitive environment where modest improvements in the manufacturing process can translate to significant cost savings. An area where improvements can be realized is reducing the number of wafers that fail to meet their electrical specifications. Wafers that fail to meet electrical specifications are scrapped, which negatively impacts yield and increases manufacturing costs. Most of the existing semiconductor process control research has focused on controlling individual steps during the manufacturing process via run-to-run control, but almost no work has looked at directly controlling device electrical characteristics. Since meeting electrical specifications is so critical to reducing scrap a fab-wide electrical parameter control scheme is proposed to directly control electrical parameter values. The goal of the controller is reducing the variation in the electrical parameters. The control algorithm uses a model to predict electrical parameter values after each processing step. Based on this prediction the decision to make a control move is made. If a control move is necessary, optimal adjustments for the subsequent processing steps are determined. The process model is continually updated so that it reflects the current process. A simple implementation using a least squares model is first proposed. Simulations and an industrial case study demonstrate the potential improvements that can be achieved with the algorithm and the limitations of the simple implementation are discussed. A partial least squares modeling and control algorithm combined with missing data algorithms are proposed as enhancements to the electrical parameter control algorithm to address many of the issues faced when implementing such a control strategy in real manufacturing environments. The enhancements take the input variable correlations into account when making control moves and utilize the correlation structure to make better model predictions. Simulations are performed to determine the effectiveness of the enhancements. A cost function formulation and a Bayesian based alternative are also presented and evaluated. The cost function implementation uses a different method to determine the optimal set points for the subsequent processing steps than the other implementations use. Simulations are used to compare the cost function formulation with the other methods presented. The Bayesian implementation addresses the stochastic nature of the manufacturing process by dealing with the probabilities of events occurring. A simulation of the Bayesian algorithm is preformed and the algorithms limitations are discussed.
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KE-CHING, WANG, and 王克勤. "The Study on Manufacturing Process of Seamless Capsule which Encapped Oil/Water Solution." Thesis, 2005. http://ndltd.ncl.edu.tw/handle/88974497147680856984.
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碩士中國醫藥大學
藥物化學研究所
93
This study was focused on the design of equipments and processes for preparation the seamless capsules. The capsule was made of gelatin, wax, cocoa butter, or their mixtures. The manufacturing process was simple and easy. These capsules can encapsulate liquids, either oil or water solution. In the manufacturing process, the parameters were studied as: the flow speed of outer and inner material solutions, the solution concentrations and compositions, the distance between orifice and level of gelling solutions that a capsule traveled in air, as well as the temperatures, volumes and the compositions of gelling solutions. The size of the outer and inner orifices greatly influenced the size of seamless capsules. These seamless capsules could be used to encapsulate liquid solutions either oil or water. The physical properties of them such as contents and disintegration, appearance, weight variation, size, and stability were investigated. Use these seamless capsules to encapsulate aqueous solutions were the advantages in this study. The technique could be applied to food, cosmetics, and drugs product.
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Huang, WEI-HSHIANG, and 黃瑋翔. "A Study on Quality Prevention and Improvement in a Electric Water Heater Manufacturing Process." Thesis, 2019. http://ndltd.ncl.edu.tw/handle/8shhwp.
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碩士國立雲林科技大學
工業工程與管理系
107
With the changing global environment and changing people's consumption habits, Taiwan's electric water heater industry is facing more and more diversified competition. No matter how the external environment changes, only by strengthening the competitiveness of enterprises and creating competitive advantages of enterprises, such as the acquisition of product quality image must be formed through continuous improvement and accumulation, and the maintenance of quality must rely on experience accumulation. To achieve quality prevention measures. Therefore, in order to improve the quality of products, we need not only to make the products well, but also to have the thinking of risk management and continuous improvement, efficient management and monitoring feedback mechanism to create the value of the existence of enterprises. This study explores the quality prevention and improvement of electric water heater manufacturing process. In the part of quality prevention, failure mode and effect analysis (FMEA) is used to discuss the possible causes of product failure in the manufacturing process of electric energy water heater. Some improvement measures are put forward to reduce the loss caused by the effect, reduce the risk priority index to an acceptable range, and prevent the causes of failure again. Occurs. In the quality improvement part, QCC and QIT are used to improve the quality. Through this study, we can improve people's ability of quality prevention and logic improvement, as well as their professional knowledge and skills.
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Hsueh, Wen-Ping, and 薛文評. "An Experimental Study on Water Hammer Effects in Process Cooling Water System of a TFT-LCD Manufacturing Plant." Thesis, 2006. http://ndltd.ncl.edu.tw/handle/yquf8w.
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碩士國立臺北科技大學
冷凍空調工程系所
94
There are many methods to avoid the damage of piping systems from water hammer. Often water hammer arresters are installed, but water hammer arresters need to be replaced periodically and the cost is significant. This study proposes to use the concept orifice bypass to lessen the effects of water hammer. An experimental test model of a typical TFT-LCD process cooling piping system was setup and an orifice plate was installed at upstream side of the control valve where water hammer effects are most likely to occur. The water pressure waves due to the abrupt closure of the control valve were studied. The relationship between the water flow speed and the water waves was studied and the most suitable diameter of orifice plate was discussed. It was found that the orifice has helped to reduce water hammer wave peak value and the duration of wave excitation. It was found that orifice diameter of more than 3 mm can reduce the water hammer effects significantly. This study also experimented with the combination of orifice and relief valve to prevent damage from water hammer effects. The results of study can help to reduce the operating cost besides reducing the risk of damage from water hammer effects.
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Hsu, Chia-Jung, and 許家榮. "Water Resources Management of High-Tech Facilities - The Study on Factors of Enhancing Manufacturing Process Water Reuse Ratio." Thesis, 2008. http://ndltd.ncl.edu.tw/handle/10382339785144385761.
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碩士國立臺灣大學
土木工程學研究所
96
The supply and demand of water resource in Taiwan is in an unstable status due to the effect of the environmental impact and global warming. Water conservation of manufacturing and ultra-pure water quality of High-Tech facilities is foreseeable to have an increasing trend as the manufacturing technology grows. In order to encourage the High-Tech manufacturers to use water resource effectively and to avoid big impact on the manufacturing operation, Science Park Administration has set high standard of water reuse ratio for manufacturers in Science Park. However, not all of manufacturers can achieve the stipulated standards. Besides, to some new comers these high standards are difficult to comply with. Moreover, the main factors affecting the manufacturers to improve their water reuse ratio are unclear. Therefore, the purpose of study is, firstly, to find out the main factors affecting the performance of manufacturing water reuse ratio and to develop strategy for managing the water resource used in High-Tech facilities. Secondly, this study illustrates related affecting factors and the items that should be evaluated in a construction life cycle pattern; hence, to provide a basis for the water usage managers. The study examines the main factors through literature review, case study and interview. The status of water usage and the monthly performance of manufacturing water reuse ratio of the studied case in recent years are examined. Then, interviews with related professionals to investigate the possible factors affecting the performance of manufacturing water reuse ratio are also performed.
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Hanu, Lucian George [Verfasser]. "Manufacturing and characterization of water filled microcomposites obtained by the PGSS process / von Lucian George Hanu." 2010. http://d-nb.info/100804704X/34.
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Wu, Wei-Jen, and 吳偉任. "Generation Process of Support Structure by Water Phase Change for Frozen-Form Additive Manufacturing of Tissue Engineering." Thesis, 2016. http://ndltd.ncl.edu.tw/handle/88796382030690568565.
Full textAbstract:
碩士國立中央大學
機械工程學系
105
Additive manufacturing technology has the advantage in rapid customization, and it is suitable for the production of tissue engineering scaffolds with high porosity and complex shape. This study is focusing on frozen-form additive manufacturing. However, it was difficult to produce the scaffolds with complex shape and porous structure, because its support structure could not be removed completely. This study developed a support process to rapidly generate the support structure and was removed completely. Firs, This study improved the uniform cryogenic device module and added environmental control module into frozen-form additive manufacturing to enhance the freezing capacity and produce large complex shape scaffolds and rapidly generate support structure. The retaining steel and the copper tube were combined to become the cooling enclosure, which reduced energy loss. The lowest temperature of the working plate became -50°C from -30°C, and the time for the temperature to reach -30°C was reduced from 150 minutes to 20 minutes. Additionally, the support structure was generated by water phase change. Liquid was sprayed on the working plate through the spray valve, and it was frozen into solid to generate the support structure. Finally, the support structure was completely removed by vaporization. According to the literatures and the result of thermal imaging camera, 10wt% ethanol solution was selected as the support material and deposited onto 75 55mm area in 35 seconds. In order to verify the effectiveness of the support process, PU/PEO was used as the scaffold material to produce cylindrical scaffolds. The cell viability testing was performed using MTT-assay. The results showed that the number of cells grew 1.8 times in 24 hours. The storage module of the scaffolds was lower with the support process, because of swelling effect, but it had a little effect on the elastic recovery. In the experimental observation, the scaffolds restored origin shape in 2 sec after extrusion. Furthermore, the micro/nano network structure of the scaffold was generated between strand and strand after the support process. The micro/nano network structure was detected by nuclear magnetic resonance spectroscopy, and the results showed that it was the material of the scaffold. Finally, the dual inverted T-type inner channels scaffold and the Y-type scaffold were produced in this study. From the above, this study verity the approach to produce large complex shape and porous structure tissue engineering scaffolds.
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Hung, Cheng-Shiun, and 洪政勛. "Using Smart Manufacturing to Improve Production Process of Water-Based Gel of Medical Ultrasound: Evidenced from Company T." Thesis, 2017. http://ndltd.ncl.edu.tw/handle/z734xz.
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碩士國立暨南國際大學
管理學院經營管理碩士學位學程碩士在職專班
105
Manpower is not easy to recruit in the current small and medium-size enterprises (SMEs) in Taiwan. This study uses the method of JIDOKA and Kanban Management of Toyota Production System, assisting by the Smart Manufacturing of Industry 4.0. Production equipment upgrades to have intelligent function by the intelligent and automation so as reduce the shortage of manpower for the SMEs is the aim of the study. The study uses Toyota Production System to manage the production site of SMEs and makes JIDOKA as a mechanism for equipment maintenance. Equipment production efficiency and availability rate can rise continually. Using Flexible Manpower Line method through the automation of equipment helps the production site to maximize the manpower for better scheduling. Minimize manpower required for product production. Using this case study research of Company T as an example, it proves that automatic execution production reduces the loss of miss operation and equipment working power energy. By the equipment self-detect function can provide the benefit of early warning of equipment problems and errors. Use the concept of big data to collection of the production data can improve process and equipment maintenance, the factory expansion in the future can be organized as well. Use Smart Manufacturing to practice Toyota Production System for SMEs is helpful in solving the problem of manpower shortage and repeated cost of training.
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Han, Shih-Hsiung, and 韓士雄. "Reclamation and reuse of clean water in flexible printed circuit board manufacturing using a RO/ion-exchange process." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/93609666112882959486.
Full textAbstract:
碩士國立屏東科技大學
環境工程與科學系所
97
In this study, we used a combined reverse osmosis (RO) membrane and ion-exchange process to treat the cleaning water used in flexible printed circuit board manufacturing processes and explored the feasibility of recycling and reusing the spent cleaning water. It was found that the treatment of spent cleaning water using only RO membrane, the system water production rate (i.e., permeate) was over 75% and the water quality was comparable to that of tap water. The conductivity of treated water was below 9.6% that of before the treatment. The water quality of RO fluid after ion-exchange treatment met the requirement for in-line processes in a plant (M) and it was recyclable and reusable for in-line processes. The return rate reached more than 10% of water consumption. Therefore, the developed technology is suitable for recycling and reusing of spent cleaning water from flexible printed circuit board manufacturing processes.
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Chang, Kuo-Lin, and 張國琳. "Study focuses on energy-saving to process cooling water system and make-up air unit reheating in display panel manufacturing." Thesis, 2014. http://ndltd.ncl.edu.tw/handle/4afkg7.
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碩士國立臺北科技大學
能源與冷凍空調工程系碩士班
102
Rely on purchased energy of the country''s total energy consumption to 99% in global energy prices continue to rise today, the direct impact on the development of domestic industries, energy consumption in high technology industries are particularly affected, while the technology industry panel factory more energy consumption is one of the highest in the ring, thus reducing the production of energy has become the most important issue in the panel manufacturing plant of one In the past of the electron manufacturing industry, the ways of saving energy were nothing more than to confer energy-intensive systems such as facility air conditioning, CDA, exhaust air etc. Somewhat, nowadays factories have slowly encountered a bottleneck, therefore, hope to make equipment also energy-efficient. This study focuses on energy-saving to process cooling water system by simplifying the cooling water loop and make-up air unit reheating adject of energy reduce . By sharing successful examples of three process tools, the aim of this paper is to decrease energy consumption and, therefore, promote industry competitiveness.
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Tseng, Wei-Ting, and 曾偉庭. "A Study of Electrolysis of Water to Produce Hydrogen Flame Torch Applied to the Decomposition of the Tail Gas of Semiconductor Manufacturing Process." Thesis, 2015. http://ndltd.ncl.edu.tw/handle/375rd2.
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碩士國立虎尾科技大學
光電工程系光電與材料科技碩士班
104
A procedure is A Study of Electrolysis of Water to Produce Hydrogen Flame Torch Applied to the Decomposition of the Tail Gas of Semiconductor Manufacturing Process Since the global warming problem and other environmental issues. The industrial pollution problems hidden behind Taiwan Semiconductor industry , an important indicator of economic development, are more attention. Semiconductor manufacturing process using a lot of specialty gases. These gases are flammable, corrosive, strong oxidizing or toxic and must be handled properly. The manufacturing process is also widely using perfluorinated compounds (PFCs), these PFCs gases will affect human blood carry oxygen function, and its F-C, F-S and F-N molecular bonds have high infrared light absorption capability. The global warming potential (GWP) of PFC Gases are thousands to tens of thousands, so there are more international organizations control PFCs gas emissions, and the development of greenhouse gases reduction plan. (PFCs including NF3、SF6、CF4、C2F6、C3F8、C4F8 、CHF3..) Currently, combustion method is more mature technology to decompose PFCs gas. At present, natural gas (methane) is using as fuel to remove PFCs, but after gas combustion still generate carbon dioxide (CO2), one of the greenhouse gases . Methane is a flammable unstable gas ,related supply equipment and piping need high initial costs and management fees , such as insurance .So combustion method still has room for improvement. The purpose of this study, is searching for a way to reduce greenhouse gases produced about harmful gas treatment unit. Using electrolysis of water to produce hydrogen, electricity stops electrolysis, no gas accumulation causing safety problem, and high-temperature hydrogen flame to destroy and removal harmful gases. CF4 gas be chose as a representative, by using Fourier transform infrared spectroscopy (Fourier transform infrared spectroscopy, FTIR) measurements Inlet and Exhaust concentration of treatment unit. And changes in burner design, gas flow path and power of electrolysis machine , investigate the Decomposition and Removal Efficiency (DRE), and the impact of energy efficiency.
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Yang, Hung-Ching, and 楊泓璟. "Experiment and Analysis on Waterborne Biodegradable Polyurethane and Chitosan Scaffold Fabricated by Frozen-Form Additive Manufacturing and Sacrificial Process using Phase Change of Water." Thesis, 2018. http://ndltd.ncl.edu.tw/handle/668rtz.
Full textAbstract:
碩士國立中央大學
機械工程學系
106
Building biological scaffolds in tissue engineering, additive manufacturing (AM) has ability to customize more quickly than conventional manufactured methods. In this study, we built the waterborne biodegradable polyurethane and chitosan scaffolds by frozen-form additive manufacturing, which spray the aqueous solution over a wide area on the support structure. Utilizing the three-phase change of water, the pore space was rapidly filled with a liquid aqueous solution deposited on the scaffold, effectively supported the aqueous solution as it solidified. Finally, freeze-dry process was used to sublimation the ice and then completely remove the support structure.
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Großmann, Anja [Verfasser]. "Influence of manufacturing process parameters on the physical properties of an oil-in-water cream = Einfluss der Herstellungsfaktoren auf die physikalischen Eigenschaften einer O-W-Creme / vorgelegt von Anja Großmann." 2008. http://d-nb.info/98880090X/34.
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