Relevant bibliographies by topics / Microelectronic technology

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'Microelectronic technology'

Author: Grafiati
Published: 28 May 2022
Last updated: 30 July 2025

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Journal articles on the topic "Microelectronic technology"

1

Liu, Pu. "Current development status and application analysis of microelectronics technology." Applied and Computational Engineering 11, no. 1 (2023): 210–15. http://dx.doi.org/10.54254/2755-2721/11/20230235.

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With the rapid development of microelectronic technology in the 21st century, microelectronic technology has been widely used in various fields, which has promoted various fields and improved the level of industrialization in the world. But there are still many problems, so this paper will introduce the application of microelectronics technology, let readers understand that microelectronics technology has a strong research prospect. The research methods of this paper are as follows. Firstly, the importance and significance of microelectronic technology are described, and the development proces
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Haskard, M. R. "Microelectronic sensor technology." Journal of Physics E: Scientific Instruments 19, no. 11 (1986): 891–96. http://dx.doi.org/10.1088/0022-3735/19/11/001.

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Fu, Boyuan. "Research on the application status of microelectronics technology in different fields." Applied and Computational Engineering 11, no. 1 (2023): 216–23. http://dx.doi.org/10.54254/2755-2721/11/20230239.

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The main focus is on the current status of the application of microelectronics in different fields. The current state of research in microelectronics is shown more visually through two experiments with diodes and MOS transistors. Then through its application in integrated circuits and automatic control shows the importance of microelectronics in today's information age, and finally through the prospect of future prospects, rational analysis of the development trend in the field of artificial intelligence, and put forward certain ideas, microelectronics can make artificial intelligence more acc
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Zhang, Ruolei. "Application and Development Trend of 5G Communication Technology in Microelectronics." International Journal of Computer Science and Information Technology 2, no. 1 (2024): 397–402. http://dx.doi.org/10.62051/ijcsit.v2n1.42.

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This study delves into the synergistic relationship between 5G communication technology and microelectronics, and how it shapes the future of the scientific and technological landscape. Through a comprehensive blend of theoretical analysis and empirical research, we examine how 5G technology propels the advancement of microelectronics, and vice versa. Our findings reveal a symbiotic relationship between the two, driving the overall progress of the electronic information industry. The distinctive features of 5G technology—high speed, minimal delay, and extensive connectivity—demand that microel
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Wang, Yinghao. "Research Progress on Key Technologies of Microelectronics for Industry 4.0." Academic Journal of Science and Technology 2, no. 3 (2022): 4–6. http://dx.doi.org/10.54097/ajst.v2i3.1434.

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With the continuous improvement of China's science and technology and economic development level, automatic control runs through all walks of life in China, and the Industry 4.0 era dominated by Internet of Things and intelligent manufacturing has gradually matured. Therefore, according to the changing market requirements, automatic control requirements have become higher and higher, and it is more and more common to integrate automatic control technology in the field of microelectronics. With the use of microelectronic technology, electrical control can be carried out more accurately, and the
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Nikitin, A. V. "Size measurements in microelectronic technology." Measurement Techniques 55, no. 8 (2012): 867–75. http://dx.doi.org/10.1007/s11018-012-0052-6.

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Slutzker, Patricia C. "Ergonomics in Microelectronic Office Technology." Occupational Health Nursing 33, no. 12 (1985): 610–14. http://dx.doi.org/10.1177/216507998503301206.

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Криштоп, В. Г., Д. А. Жевненко, П. В. Дудкин та ін. "ТЕХНОЛОГИЯ И ПРИМЕНЕНИЕ ЭЛЕКТРОХИМИЧЕСКИХ ПРЕОБРАЗОВАТЕЛЕЙ". NANOINDUSTRY Russia 96, № 3s (2020): 450–55. http://dx.doi.org/10.22184/1993-8578.2020.13.3s.450.455.

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Электрохимические системы очень перспективны для разработки новой элементной базы для микроэлектроники и для использования в широком спектре инженерных задач. Мы разработали новую микроэлектронную технологию для изготовления электрохимических преобразователей (ЭХП) и новые приборы на основе новых электрохимических микроэлектронных чипов. Планарные электрохимические преобразователи могут использоваться в акселерометрах, сейсмических датчиках, датчиках вращения, гидрофонах и датчиках давления. Electrochemical systems are very promising for the development of a new element base for microelectroni
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De Ying Chen and Guo Hang Tang. "Vacuum microelectronic diode using bonding technology." Sensors and Actuators A: Physical 55, no. 2-3 (1996): 149–52. http://dx.doi.org/10.1016/s0924-4247(97)80070-2.

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Zhu, Bo. "Microelectronics innovation and implementation in intelligent transportation systems." Theoretical and Natural Science 9, no. 1 (2023): 208–13. http://dx.doi.org/10.54254/2753-8818/9/20240751.

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Under the background of urbanization and rapid development of transportation, the innovation of intelligent transportation system has become the key to improving traffic efficiency, relieving traffic pressure, and solving traffic problems. With the continuous progress of microelectronics technology, its application in the field of intelligent transportation is becoming more and more eye-catching. This paper focuses on the innovation and realization of micro-electronic technology in intelligent transportation system, and discusses the application of micro-electronic technology in intelligent na
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Dissertations / Theses on the topic "Microelectronic technology"

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Al-Nedawe, Basman M. "Microelectronic implementation of dicode PPM system employing RS codes." Thesis, University of Huddersfield, 2014. http://eprints.hud.ac.uk/id/eprint/26229/.

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Optical fibre systems have played a key role in making possible the extraordinary growth in world-wide communications that has occurred in the last 25 years, and are vital in enabling the proliferating use of the Internet. Its high bandwidth capabilities, low attenuation characteristics, low cost, and immunity from the many disturbances that can afflict electrical wires and wireless communication links make it ideal for gigabit transmission and a major building block in the telecommunication infrastructure. A number of different techniques are used for the transmission of digital information b
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Zhu, Qi. "Helix-type compliant off-chip interconnect for microelectronic packaging." Diss., Georgia Institute of Technology, 2003. http://hdl.handle.net/1853/17541.

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Li, Yiming. "Plasma processing of advanced interconnects for microelectronic applications." Diss., Georgia Institute of Technology, 2002. http://hdl.handle.net/1853/11034.

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Ma, Lunyu. "Design and development of stress-engineered compliant interconnect in microelectronic packaging." Diss., Georgia Institute of Technology, 2003. http://hdl.handle.net/1853/16066.

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Haemer, Joseph Michael. "Thermo-mechanical modeling and design of micro-springs for microelectronic probing and packaging." Thesis, Georgia Institute of Technology, 2000. http://hdl.handle.net/1853/16830.

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Zhang, Jian. "In-process stress analysis of flip chip assembly and reliability assessment during environmental and power cycling tests." Diss., Available online, Georgia Institute of Technology, 2004:, 2003. http://etd.gatech.edu/theses/available/etd-04082004-180504/unrestricted/zhang%5fjian%5f200312%5fphd.pdf.

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Ma, Wei. "Low temperature metal-based micro fabrication and packaging technology /." View abstract or full-text, 2005. http://library.ust.hk/cgi/db/thesis.pl?MECH%202005%20MA.

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McCaslin, Luke. "Methodology for predicting microelectronic substrate warpage incorporating copper trace pattern characteristics." Thesis, Atlanta, Ga. : Georgia Institute of Technology, 2008. http://hdl.handle.net/1853/24641.

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Lin, Ta-Hsuan. "Assembly process development, reliability and numerical assessment of copper column flexible flip chip technology." Diss., Online access via UMI:, 2008.

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Thesis (Ph. D.)--State University of New York at Binghamton, Department of Systems Science and Industrial Engineering, Thomas J. Watson School of Engineering and Applied Science, 2008.<br>Includes bibliographical references.
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Ng, Siu Lung. "Effect of thermal and mechanical factors on single and multi-chip BGA packages." Diss., Online access via UMI:, 2007.

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Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2007.<br>Includes bibliographical references.
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Books on the topic "Microelectronic technology"

1

K, Board, and Cockrum Richard H, eds. An introduction to microelectronic technology. Wiley & Sons, 1985.

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Dick, Potter, Peters Laura, and Integrated Circuit Engineering Corporation, eds. Roadmaps of packaging technology. Integrated Circuit Engineering, 1997.

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Madhav, Datta, Ōsaka Tetsuya 1945-, and Schultze J. W, eds. Microelectronic packaging. CRC Press, 2005.

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Bhushan, Manjul, and Mark B. Ketchen. Microelectronic Test Structures for CMOS Technology. Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4419-9377-9.

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Bhushan, Manjul. Microelectronic Test Structures for CMOS Technology. Springer Science+Business Media, LLC, 2011.

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Barry, Chin, ed. Copper interconnect technology. SPIE Press, 2001.

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7

Sedra, Adel S. Microelectronic circuits. 3rd ed. Oxford UniversityPress, 1995.

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8

Jin, Yufeng. Introduction to microsystem packaging technology. CRC Press/Taylor & Francis, 2011.

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9

Jet Propulsion Laboratory (U.S.), ed. Microdevices Laboratory, MDL: Space Microelectronic Device Technology Section : Jet Propulsion Laboratory : Center for Space Microelectronics Technology--. National Aeronautics and Space Administration, Jet Propulsion Laboratory, California Institute of Technology, 1990.

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Jet Propulsion Laboratory (U.S.), ed. Microdevices Laboratory, MDL: Space Microelectronic Device Technology Section : Jet Propulsion Laboratory : Center for Space Microelectronics Technology--. National Aeronautics and Space Administration, Jet Propulsion Laboratory, California Institute of Technology, 1990.

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Book chapters on the topic "Microelectronic technology"

1

Riedling, Karl. "Ellipsometry in Microelectronic Technology." In Ellipsometry for Industrial Applications. Springer Vienna, 1988. http://dx.doi.org/10.1007/978-3-7091-8961-0_2.

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Ahuja, Anil. "From Microelectronic Technology to Information Technology." In Integration of Nature and Technology for Smart Cities. Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-25715-0_8.

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Ahuja, Anil. "From Microelectronic Technology to Information Technology." In Integrated M/E Design. Springer US, 1997. http://dx.doi.org/10.1007/978-1-4757-5514-5_16.

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Shi, Songhua, and Peter Tortorici. "Fundamentals of Advanced Materials and Processes in Organic Substrate Technology." In 3D Microelectronic Packaging. Springer International Publishing, 2017. http://dx.doi.org/10.1007/978-3-319-44586-1_11.

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Shi, Songhua, Peter Tortorici, Sai Vadlamani, and Prithwish Chatterjee. "Fundamentals of Advanced Materials and Processes in Organic Substrate Technology." In 3D Microelectronic Packaging. Springer Singapore, 2020. http://dx.doi.org/10.1007/978-981-15-7090-2_14.

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Lee, Sangil. "Fundamentals of Bonding Technology and Process Materials for 2.5/3D Packages." In 3D Microelectronic Packaging. Springer Singapore, 2020. http://dx.doi.org/10.1007/978-981-15-7090-2_10.

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Borgmann, Albert. "Philosophical Reflections on the Microelectronic Revolution." In Philosophy and Technology II. Springer Netherlands, 1986. http://dx.doi.org/10.1007/978-94-009-4512-8_13.

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Lee, Sangil. "Fundamentals of Thermal Compression Bonding Technology and Process Materials for 2.5/3D Packages." In 3D Microelectronic Packaging. Springer International Publishing, 2017. http://dx.doi.org/10.1007/978-3-319-44586-1_7.

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Kolesár, František, and Miloš Somora. "The Usage of the Polymer Inks in Interconnection Technology." In Microelectronic Interconnections and Assembly. Springer Netherlands, 1998. http://dx.doi.org/10.1007/978-94-011-5135-1_30.

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Cognetti, Carlo. "Flip Chip Technology: Is It Time of Mass Production?" In Microelectronic Interconnections and Assembly. Springer Netherlands, 1998. http://dx.doi.org/10.1007/978-94-011-5135-1_8.

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Conference papers on the topic "Microelectronic technology"

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Liu, Y. S. "Laser processing for interconnect technology." In OSA Annual Meeting. Optica Publishing Group, 1990. http://dx.doi.org/10.1364/oam.1990.tuhh1.

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The development of high-power UV excimer laser sources has opened up many new opportunities in applications of lasers to material processing. The recent development of many new nonlinear optical materials has further extended the spectral coverage of high-repetition-rate solid-state lasers to deep UV (6 eV). These advances have made lasers powerful processing tools for microfabrication with either the direct-writing or projection technique. In the meantime, the rapid advance in high-speed microelectronics has significantly increased the demand for in situ and adaptive processing techniques for
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Freedman, James F. "21st century microelectronic technology trends." In Smart Structures & Materials '95, edited by Vijay K. Varadan. SPIE, 1995. http://dx.doi.org/10.1117/12.210460.

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"Microelectronic engineering." In Proceedings Electronic Technology Directions to the Year 2000. IEEE, 1995. http://dx.doi.org/10.1109/etd.1995.403468.

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Edelstein, Daniel C. "Copper chip technology." In Microelectronic Manufacturing, edited by Anthony J. Toprac and Kim Dang. SPIE, 1998. http://dx.doi.org/10.1117/12.324345.

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Edelstein, Daniel C. "Copper chip technology." In Microelectronic Manufacturing, edited by David Burnett, Dirk Wristers, and Toshiaki Tsuchiya. SPIE, 1998. http://dx.doi.org/10.1117/12.323969.

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Sun, Jack Y. C. "Foundry technology trend." In Microelectronic Manufacturing, edited by David Burnett, Dirk Wristers, and Toshiaki Tsuchiya. SPIE, 1998. http://dx.doi.org/10.1117/12.323970.

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Edelstein, Daniel C. "Copper chip technology." In Microelectronic Manufacturing, edited by Mart Graef and Divyesh N. Patel. SPIE, 1998. http://dx.doi.org/10.1117/12.324035.

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Sun, Jack Y. C. "Foundry technology trend." In Microelectronic Manufacturing, edited by Mart Graef and Divyesh N. Patel. SPIE, 1998. http://dx.doi.org/10.1117/12.324036.

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Sun, Jack Y. C. "Foundry technology trend." In Microelectronic Manufacturing, edited by Anthony J. Toprac and Kim Dang. SPIE, 1998. http://dx.doi.org/10.1117/12.324346.

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Sun, Jack Y. C. "Foundry technology trend." In Microelectronic Manufacturing, edited by Sharad Prasad, Hans-Dieter Hartmann, and Tohru Tsujide. SPIE, 1998. http://dx.doi.org/10.1117/12.324380.

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Reports on the topic "Microelectronic technology"

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Kiv, A. E., T. I. Maximova, and V. N. Soloviov. MD Simulation of the Ion-Stimulated Relaxation in Silicon Surface Layers. [б. в.], 2000. http://dx.doi.org/10.31812/0564/1278.

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Thus it was established that ion bombardment of silicon surface in the energy region of the threshold of elastic displacement of atoms might allow to improve structural characteristics of surface lavers and to decrease the relaxation time. Energy dependencies of radiation induced processes show a possibility to improve the real staicture of Silicon surface and to accelerate the long-term surface relaxation in microelectronic technology.
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Butler, Jr, and Daniel H. SETA Support for the DARPA Microelectronics Technology Insertion Program of the Microelectronics Technology Office. Defense Technical Information Center, 1992. http://dx.doi.org/10.21236/ada255551.

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Goland, A. N. Plan for advanced microelectronics processing technology application. Office of Scientific and Technical Information (OSTI), 1990. http://dx.doi.org/10.2172/5706029.

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Philippi, Therese M. Vision Technology for Automated Inspection of Hybrid Microelectronics Assemblies. Defense Technical Information Center, 1988. http://dx.doi.org/10.21236/ada198790.

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Goland, A. N. Plan for advanced microelectronics processing technology application. Final report. Office of Scientific and Technical Information (OSTI), 1990. http://dx.doi.org/10.2172/10119603.

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Gover, J. E., and C. W. Gwyn. Using federal technology policy to strength the US microelectronics industry. Office of Scientific and Technical Information (OSTI), 1994. http://dx.doi.org/10.2172/10176078.

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Knight, Stephen, Joaquin V. Martinez de Pinillos, Barbara J. Belzer, and Michele Buckley. Silicon microelectronics programs at the National Institute of Standards and Technology:. National Institute of Standards and Technology, 2001. http://dx.doi.org/10.6028/nist.ir.6731.

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Pinillos, Stephen Knight;Joaquin V. Martinez de, and Michele Buckley. Silicon microelectronics programs at the National Institute of Standards and Technology:. National Institute of Standards and Technology, 2002. http://dx.doi.org/10.6028/nist.ir.6884.

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Pinillos, Joaquin V. Martinez de, Stephen Knight, and Alice Settle-Raskin. Silicon microelectronics programs at the National Institute of Standards and Technology:. National Institute of Standards and Technology, 2000. http://dx.doi.org/10.6028/nist.ir.6522.

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Rosenthal, Peter. HTS Josephson Technology on Silicon with Application to High Speed Digital Microelectronics. Defense Technical Information Center, 1994. http://dx.doi.org/10.21236/ada285964.

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