Academic literature on the topic 'Packaging conditions'
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Journal articles on the topic "Packaging conditions"
Piscopo, Amalia, Angela Zappia, Alessandra de Bruno, and Marco Poiana. "Qualitative variations on Calabrian Provola cheeses stored under different packaging conditions." Journal of Dairy Research 82, no. 4 (2015): 499–505. http://dx.doi.org/10.1017/s0022029915000539.
Full textDordevic, Simona, Dani Dordevic, Karolina Tesikova, and Bohuslava Tremlova. "Effect of Trehalose/OEO/Tween 80/Tween 20 Addition on Physical Stability of Edible Packaging during Storage in Different Humidity Conditions." Foods 12, no. 15 (2023): 2903. http://dx.doi.org/10.3390/foods12152903.
Full textKirnosova, Maryna. "Packaging of organic fertilizers in circular economy conditions." Marketing and Digital Technologies 7, no. 3 (2024): 6–16. https://doi.org/10.15276/mdt.8.3.2024.1.
Full textNájera, Ana Isabel, Maider Murua, Olaia Martínez, Marta Albisu, and Luis Javier R. Barron. "A Sustainable Material for Sheep’s Cheese Wedges Stored under Different Atmosphere Conditions." Foods 13, no. 9 (2024): 1423. http://dx.doi.org/10.3390/foods13091423.
Full textLal, Shiv, Lal Chand, K. L. Kumawat, and O. C. Sharma. "Effect of Packaging System and Storage Conditions on Quality Retention of Shelled Walnut." International Journal of Bio-resource and Stress Management 14, Mar, 3 (2023): 407–13. http://dx.doi.org/10.23910/1.2023.3309.
Full textAlanazi, Abdulrahman Hamoud. "Stability Analysis of Pharmaceutical Preparations under Different Storage Conditions." Journal of Medical Science and clinical Research 12, no. 09 (2024): 17–20. http://dx.doi.org/10.18535/jmscr/v12i09.03.
Full textKim, Hyun-Joo, You-Geun Oh, Kyeong-Hoon Kim, et al. "Microbial growth and quality characteristics of wheat under different packaging conditions in plasma storage." Food Science and Preservation 32, no. 1 (2025): 118–23. https://doi.org/10.11002/fsp.2025.32.1.118.
Full textRóth, E., J. Barriobero, B. Ozcoz, J. Mir-Bel, and R. López. "Optimising packaging conditions of fresh-cut nectarine." Acta Horticulturae, no. 1209 (August 2018): 87–94. http://dx.doi.org/10.17660/actahortic.2018.1209.13.
Full textKim, Young-Jun, Hyeon-Wee Kim, and Myong-Soo Chung. "Optimum Packaging Conditions for Maintaining Curcumin Stability." Food Engineering Progress 9, no. 4 (2005): 268–75. http://dx.doi.org/10.13050/foodengprog.2005.9.4.268.
Full textRymovskaya, Mariya V., Maksim V. Ratkevich, Irina A. Grebenchikova, and Denis S. Sergievich. "POLYMER PACKAGE BIOLOGICAL DESTRUCTION AT CONDITIONS APPROXIMATED TO NATURAL." Journal of the Belarusian State University. Ecology., no. 4 (December 25, 2021): 103–13. http://dx.doi.org/10.46646/2521-683x/2021-4-103-113.
Full textDissertations / Theses on the topic "Packaging conditions"
McSweeney, Anne Margaret. "A material cost and weight comparison of shipping containers using ect versus burst strength for room air conditions /." Online version of thesis, 1993. http://hdl.handle.net/1850/11986.
Full textMontero, Calderón Marta. "Internal quality profile and influence of packaging conditions on fresh-cut pineapple." Doctoral thesis, Universitat de Lleida, 2010. http://hdl.handle.net/10803/51010.
Full textYang, Chaoran. "Comparison of thermal fatigue reliability between SAC and SnPb solders under various stress range conditions /." View abstract or full-text, 2009. http://library.ust.hk/cgi/db/thesis.pl?MECH%202009%20YANGC.
Full textLiu, Yangyang [Verfasser]. "Atherosclerotic conditions promote the packaging of functional microRNA-92 into endothelial microvesicles / Yangyang Liu." Bonn : Universitäts- und Landesbibliothek Bonn, 2019. http://d-nb.info/1185636951/34.
Full textPyland, James. "Damage metric-based thermal cycling guidelines for area-array packages used in harsh thermal conditions." Thesis, Georgia Institute of Technology, 2002. http://hdl.handle.net/1853/18851.
Full textGros, Céline. "Durabilité de joints adhésifs silicone sous conditions environnementales sévères : application au packaging en électronique de puissance." Phd thesis, Toulouse, INPT, 2006. http://oatao.univ-toulouse.fr/7643/1/gros.pdf.
Full textGros, Céline Petit Jacques-Alain. "Durabilité de joints adhésifs silicone sous conditions environnementales sévères application au packaging en électronique de puissance /." Toulouse : INP Toulouse, 2008. http://ethesis.inp-toulouse.fr/archive/00000562.
Full textTyler, Carla Gutierrez. "Acceptability and Shelf-Life of Fresh and Pasteurized Crab Meat Stored Under Different Environmental Conditions." Thesis, Virginia Tech, 2009. http://hdl.handle.net/10919/41293.
Full textAyvaz, Huseyin. "Influence of Packaging Material and Storage Conditions on the Quality Attributes of Pressure-Assisted Thermally Processed Carrots." The Ohio State University, 2010. http://rave.ohiolink.edu/etdc/view?acc_num=osu1281125846.
Full textDavis, Marjorie Lynn. "Survival of Escherichia coli O157:H7 on cut and whole surfaces of spinach and leaf lettuce, packaged under modified atmospheric conditions." Thesis, Virginia Tech, 2008. http://hdl.handle.net/10919/34925.
Full textBooks on the topic "Packaging conditions"
Curley, Ian J. An analysis of the business environment in Czechoslovakia: With reference to the print and packaging industry. University College Dublin, 1991.
Find full textAudin, Lindsay. Nuclear waste shipping container response to severe accident conditions: A brief critique of the modal study. State of Nevada, Agency for Nuclear Projects/Nuclear Waste Project Office, 1990.
Find full textBrown, Lyn Mikel, and Sharon Lamb. Packaging Girlhood: Rescuing Our Daughters from Marketers' Schemes. St. Martin's Press, 2006.
Find full text1943-, Lewis Glen, and Osborne G, eds. Communication traditions in Australia: Packaging the people. 2nd ed. Oxford University Press, 2001.
Find full textConrad, Christopher. Income packaging in historical perspective: Public and private support for the elderly in Germany, 1890s-1950s. Minda de Gunzburg Center for European Studies, 1995.
Find full textJanet, Shipton, ed. Designing for re-use: The life of consumer packaging. Earthscan, 2010.
Find full textGreat Britain. Health and Safety Commission., ed. Information approved for the classification, packaging, and labelling of dangerous substances for supply and conveyance by road. 2nd ed. H.M.S.O., 1988.
Find full textZabashta, Andrey, Tat'yana Shalimova, and Valer'yan Basov. Egg processing technology. INFRA-M Academic Publishing LLC., 2020. http://dx.doi.org/10.12737/1085371.
Full textMoiseenko, Nina. Basics of managing the assortment of non-food products. INFRA-M Academic Publishing LLC., 2023. http://dx.doi.org/10.12737/1882572.
Full textBook chapters on the topic "Packaging conditions"
Canpolat, Mutlu. "Package-Borne Safety Issues in Food." In Food Safety. Nobel Tip Kitabevleri, 2024. http://dx.doi.org/10.69860/nobel.9786053358787.22.
Full textJahnavi, M., B. Madhavi, Ch Varshini, and M. Parvathi. "Design of sample-hold circuit for optimal operating conditions." In Recent Trends in VLSI and Semiconductor Packaging. CRC Press, 2025. https://doi.org/10.1201/9781003616399-45.
Full textGoksen, Gulden, P. Nisha, and H. Ibrahim Ekiz. "Electrospinning Technology: Its Process Conditions and Food Packaging Applications." In Food Engineering Series. Springer International Publishing, 2022. http://dx.doi.org/10.1007/978-3-030-92415-7_12.
Full textZhi, Xiujuan, Yinghao Xing, Dongxiao Huang, Qigen Tong, Bin Du, and Jun Wu. "Influences of Cleaning and Coating Conditions on the Quality of Eggs." In Advanced Graphic Communications, Packaging Technology and Materials. Springer Singapore, 2015. http://dx.doi.org/10.1007/978-981-10-0072-0_68.
Full textLiu, Xinyan, Lili Yu, Xiaojun Ma, and Lizhi Zhu. "Studies on the Compound Conditions of Nano-SiO2 Based ACQ Preservative." In Advanced Graphic Communications, Packaging Technology and Materials. Springer Singapore, 2015. http://dx.doi.org/10.1007/978-981-10-0072-0_90.
Full textFeng, Mengke, Guorong Cao, and Jiazi Shi. "Effect of Film-Forming Conditions on the Properties of Fluorinated Acrylate Film." In Advanced Graphic Communications, Packaging Technology and Materials. Springer Singapore, 2015. http://dx.doi.org/10.1007/978-981-10-0072-0_98.
Full textLv, Xi, and Ming Ronnier Luo. "Newcolour Appearance Scales Under High Dynamic Range Conditions." In Advances in Graphic Communication, Printing and Packaging Technology and Materials. Springer Singapore, 2021. http://dx.doi.org/10.1007/978-981-16-0503-1_10.
Full textTian, Quanhui, Bo Zhang, Ping Gu, and Shenwei Yang. "Study of the Morphological Character of Spectral Reflectance of UV Flexopress in Different Conditions." In Advances in Graphic Communication, Printing and Packaging. Springer Singapore, 2019. http://dx.doi.org/10.1007/978-981-13-3663-8_24.
Full textShen, Z., and O. Fanini. "Die-Attach Materials for Extreme Conditions and Harsh Environments." In Die-Attach Materials for High Temperature Applications in Microelectronics Packaging. Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-319-99256-3_10.
Full textXu, Qianqian, Kai Liu, and Zhuofei Xu. "Research on Fractional Lower Order Feature Extraction of Bearing Vibration Signals Under Alpha Stable Noise Conditions." In Advances in Graphic Communication, Printing and Packaging. Springer Singapore, 2019. http://dx.doi.org/10.1007/978-981-13-3663-8_79.
Full textConference papers on the topic "Packaging conditions"
Duan, Xinfang, Lei Su, Ke Li, Jiefei Gu, Xinwei Zhao, and Michael Pecht. "The Optimum Conditions of Loose Particles Detection for Microelectronic Packaging." In 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC). IEEE, 2024. https://doi.org/10.1109/eptc62800.2024.10909841.
Full textLaw, Owen Yi Kei, Haibo Fan, Nick Chenchao Zhong, and Yuning Shi. "Investigation of the Electromigration Behavior of Solder Bump Under Different Conditions." In 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC). IEEE, 2024. https://doi.org/10.1109/eptc62800.2024.10909831.
Full textJiang, Xuening, Chenghao Zhang, Zhen Pan, Jun Wang, and Yang Liu. "Failure Characteristics and Mechanisms of Sn-Based Solder Interconnections Under Vibrational Conditions." In 2024 25th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2024. http://dx.doi.org/10.1109/icept63120.2024.10668776.
Full textCai, Jinhao, Yongjie Peng, Jianfeng Fan, Shuanzhu Fang, Hongyue Wang, and Zhizhe Wang. "The Reverse Bias Reliability of SiC MOSFET Under Different Conditions and Failure Analysis." In 2024 25th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2024. http://dx.doi.org/10.1109/icept63120.2024.10668576.
Full textYang, Jie, Junyi Yu, Haitao Huang, Suibin Luo, and Shuhui Yu. "Electric Breakdown Mechanism of Build-up Films under High-Temperature and High-Humidity Conditions." In 2024 25th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2024. http://dx.doi.org/10.1109/icept63120.2024.10668525.
Full textCarazzetti, Patrik, Carl Drechsel, Nico Härtl, Jürgen Weichart, Kay Viehweger, and Ewald Strolz. "Investigation of UBM/RDL Contact Resistance Based on ICP Sputter Etch Conditions and Critical Design Dimensions." In 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC). IEEE, 2024. https://doi.org/10.1109/eptc62800.2024.10909756.
Full textBalestra, Luigi, Muhammad Tanveer Riaz, Federico Giuliano, et al. "Dielectric Breakdown of In-Package Epoxy Mold Compound Under Wet and Dry Conditions: Frequency and Temperature Dependence." In 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC). IEEE, 2024. https://doi.org/10.1109/eptc62800.2024.10909803.
Full textNie, Lei, Mingzhi Dong, Jian Cai, Michael Osterman, and Michael Pecht. "Interfacial reaction of reballed BGAs under isothermal aging conditions." In High Density Packaging (ICEPT-HDP). IEEE, 2009. http://dx.doi.org/10.1109/icept.2009.5270671.
Full textSadeghinia, M., K. M. B. Jansen, L. J. Ernst, and H. Pape. "Fracture properties of Cu-EMC interfaces at harsh conditions." In 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP). IEEE, 2012. http://dx.doi.org/10.1109/icept-hdp.2012.6474816.
Full textMay, Cecil G., Lawrence F. Gelder, and Boyd D. Howard. "The Use of Digital Radiography in the Evaluation of Radioactive Materials Packaging Performance Testing." In ASME 2007 Pressure Vessels and Piping Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/pvp2007-26590.
Full textReports on the topic "Packaging conditions"
Long, Kevin Nicholas, Mark E. Stavig, Christine Cardinal Roberts, and Lisa Ann Mondy. Mechanical Behavior of MinK and FiberFrax Board Insulation Materials Under Battery Packaging Relevant Conditions. Office of Scientific and Technical Information (OSTI), 2017. http://dx.doi.org/10.2172/1528800.
Full textBryant, C. A., S. A. Wilks, and C. W. Keevil. Survival of SARS-CoV-2 on the surfaces of food and food packaging materials. Food Standards Agency, 2022. http://dx.doi.org/10.46756/sci.fsa.kww583.
Full textPatil, Bhimanagouda S., Ron Porat, G. K. Jayaprakasha, and K. N. C. Murthy. Optimization of Postharvest Storage Conditions to Maintain Fruit Quality and Health Maintaining Properties of Grapefruit. United States Department of Agriculture, 2010. http://dx.doi.org/10.32747/2010.7613879.bard.
Full textBurak, Leonid Ch, and Nataliya L. Ovsyannikova. Modern methods of strawberry fruit (Fragaria × ananassa Duch.) post-harvest treatment (review). Contemporary horticulture, 2024. https://doi.org/10.12731/2312-6701-265352.
Full textYousefnia Pasha, Hassan, Seyed Saeid Mohtasebi, Reza Tabatabaeekoloor, Behjat Tajeddin, Mahmoud Soltani Firouz, and Masoumeh Taherimehr. The effect of a new bionanocomposite packaging film on postharvest quality of strawberry at modified atmosphere condition. Peeref, 2023. http://dx.doi.org/10.54985/peeref.2306p5517308.
Full textBotulinum Neurotoxin-Producing Clostridia, Working Group on. Report on Botulinum Neurotoxin-Producing Clostridia. Food Standards Agency, 2023. http://dx.doi.org/10.46756/sci.fsa.ozk974.
Full textสิริภัทราวรรณ, อุบลรัตน์, สุวัสสา พงษ์อำไพ та สุภาภรณ์ ดั๊กกลาส. การใช้ฟิล์มเคลือบบริโภคได้จากไคโตซานเพื่อยืดอายุการเก็บของผลิตภัณฑ์อาหารแช่เย็นพร้อมบริโภคได้ : รายงานการวิจัย. จุฬาลงกรณ์มหาวิทยาลัย, 2009. https://doi.org/10.58837/chula.res.2009.42.
Full textBendikov, Michael, and Thomas C. Harmon. Development of Agricultural Sensors Based on Conductive Polymers. United States Department of Agriculture, 2006. http://dx.doi.org/10.32747/2006.7591738.bard.
Full textGalili, Naftali, Roger P. Rohrbach, Itzhak Shmulevich, Yoram Fuchs, and Giora Zauberman. Non-Destructive Quality Sensing of High-Value Agricultural Commodities Through Response Analysis. United States Department of Agriculture, 1994. http://dx.doi.org/10.32747/1994.7570549.bard.
Full textOrbeta, Aniceto Jr, Marife Ballesteros, John Paul Corpus, Vicente Paqueo, and Celia Reyes. Impacts of the Sustainable Livelihood Program's Microenterprise Development Assistance with Seed Capital Fund on Poor Households in the Philippines. Philippine Institute for Development Studies, 2020. https://doi.org/10.62986/dp2020.36.
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